DIP-64_W26.67mm_SMDSocket_LongPads

Package_DIP

64-lead though-hole mounted DIP package, row spacing 26.67mm (1050 mils), SMDSocket, LongPads

Footprint

64 pads

Footprint DIP-64_W26.67mm_SMDSocket_LongPads

Mount: Surface mount
Courtyard: 30.28 × 81.9 mm
Pads: 64
File: 11 KB

3D model

STEP

Package_DIP_DIP-64_W26.67mm_SMDSocket

28 × 81.40 × 3.68 mm

1.7 MB STEP

Library: Package_DIP_DIP-64_W26.67mm
Model page: Open →

Provenance

Source: kicad-footprints
Credit: KiCad Libraries Contributors
Licence: CC-BY-SA-4.0-with-KiCad-exception