HSOP-36-1EP_11.0x15.9mm_P0.65mm_SlugDown_ThermalVias

Package_SO

HSOP 11.0x15.9mm Pitch 0.65mm Slug Down Thermal Vias (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf)

HSOP
11.0
x
15.9mm
Pitch
0.65mm

Footprint

37 pads

Mount: Surface mount
Courtyard: 15.9 × 16.6 mm
Pads: 37
File: 14 KB

3D model

none

no 3D model

This footprint names no 3D model, or names one the upstream package set never shipped. Nothing is shown rather than a model that 404s.

Provenance

Source: kicad-footprints
Credit: KiCad Libraries Contributors
Licence: CC-BY-SA-4.0-with-KiCad-exception