SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.514x3.2mm_ThermalVias

Package_SO

SOIC, 8 Pin (https://www.renesas.com/eu/en/www/doc/datasheet/hip2100.pdf#page=13)

Footprint

9 pads
Footprint SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.514x3.2mm_ThermalVias
Mount
Surface mount
Courtyard
7.4 × 5.4 mm
Pads
9
File
6 KB

3D model

none
no 3D model

This footprint names no 3D model, or names one the upstream package set never shipped. Nothing is shown rather than a model that 404s.

On real boards

The largest boards that carry it

DesignPartsNetsLayersBoardLicenceSource
Pic 16F887 With HCSR044876250 × 60 mmCC-BY-4.0Oopsan204/Pic-16F887-with-HCSR04 ↗
Split Flap Fae Pcb4664240.01 × 80 mmCC-BY-4.0codingcatgirl/split-flap-fae-pcb ↗

Provenance

Credit
KiCad Libraries Contributors
Licence
CC-BY-SA-4.0-with-KiCad-exception