SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.34x2.34mm_ThermalVias
Package_SO
SOIC, 8 Pin (JEDEC MS-012 variation BA (thermally enhanced), using tolerances and Exposed Pad from Texas Instruments DDA0008A, https://www.ti.com/lit/ml/pptd272a/pptd272a.pdf, https://www.ti.com/lit/ds/symlink/tps92511.pdf#page=29, https://www.jedec.org/document_search?search_api_views_fulltext=MS-012)
Footprint
9 pads- Mount
- Surface mount
- Courtyard
- 7.4 × 5.4 mm
- Pads
- 9
- File
- 7 KB
3D model
noneno 3D model
This footprint names no 3D model, or names one the upstream package set never shipped. Nothing is shown rather than a model that 404s.
Parts that use it
1 component in the catalog place this footprint
Provenance
- Source
- kicad-footprints
- Credit
- KiCad Libraries Contributors
- Licence
- CC-BY-SA-4.0-with-KiCad-exception
