SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.71x3.4mm

Package_SO

SOIC, 8 Pin (JEDEC MS-012 variation BA (thermally enhanced), using tolerances and Exposed Pad from Texas Instruments DDA0008B, https://www.ti.com/lit/ml/pptd058j/pptd058j.pdf, https://www.ti.com/lit/ds/symlink/lm5017.pdf#page=35, https://www.jedec.org/document_search?search_api_views_fulltext=MS-012)

Footprint

9 pads
Footprint SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.71x3.4mm
Mount
Surface mount
Courtyard
7.4 × 5.4 mm
Pads
9
File
6 KB

3D model

none
no 3D model

This footprint names no 3D model, or names one the upstream package set never shipped. Nothing is shown rather than a model that 404s.

On real boards

The largest boards that carry it

DesignPartsNetsLayersBoardLicenceSource
MAINBOARD2178245280 × 145 mmCC-BY-4.0midarubiccube/mainboard2
Magdy0 Proto V0 BOARD214971299.97 × 99.4 mmCC-BY-4.0Omar-Magdy0/Proto_V0
TGT Kicad Data ぱわこ106854100 × 50 mmMITsabanekko3/TGT_kicad_data
2425 Projet2A AresCFR BOARD53559238.75 × 40.16 mmCC-BY-4.0AresEnsea/2425_Projet2A_AresCFR

Provenance

Credit
KiCad Libraries Contributors
Licence
CC-BY-SA-4.0-with-KiCad-exception