TI_SO-PowerPAD-8_ThermalVias

Package_SO

8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias with large copper area, as proposed in http://www.ti.com/lit/ds/symlink/tps5430.pdf

Footprint

9 pads
Footprint TI_SO-PowerPAD-8_ThermalVias
Mount
Surface mount
Courtyard
7.5 × 5.5 mm
Pads
9
File
6 KB

3D model

none
no 3D model

This footprint names no 3D model, or names one the upstream package set never shipped. Nothing is shown rather than a model that 404s.

Parts that use it

7 components in the catalog place this footprint

On real boards

The largest boards that carry it

DesignPartsNetsLayersBoardLicenceSource
WomoLIN5346274254.89 × 150.11 mmCC-BY-4.0muccc/WomoLIN
OCTAVIA5293654178 × 99 mmCC-BY-4.0freeDSP/freeDSP-OCTAVIA
Fmcw BOARD24154344119.57 × 58.93 mmCC-BY-4.0matthuszagh/fmcw
G3773144170 × 101 mmCC-BY-4.0freeDSP/FreeDSP-G
Prodigy BOARD43733974160 × 120 mmCC-BY-4.0mark69163/prodigy
KASM PCB3482854115.82 × 104.14 mmCC-BY-4.0gabeak2/KASM_PCB
OpenEFI3453684164 × 118 mmCC-BY-4.0Churrosoft/OpenEFI-PCB
OpenEFI3453684164 × 118 mmCC-BY-4.0Churrosoft/OpenEFI-PCB
Pocket Reform BOARD103135256151 × 88 mmCC-BY-4.0wdouglass/pocket-reform
Hw Openmower Yardforce2743264180 × 170 mmCC-BY-4.0xtech/hw-openmower-yardforce
KASM ACTUATOR PCB REV22682816120.95 × 70.61 mmCC-BY-4.0gabeak2/KASM_ACTUATOR_PCB_REV2
Explorer2682002100 × 100 mmCC-BY-4.0anyshake/explorer

Provenance

Credit
KiCad Libraries Contributors
Licence
CC-BY-SA-4.0-with-KiCad-exception