TO-262-3_Vertical

Package_TO_SOT_THT

TO-262-3, Vertical, RM 2.54mm, IIPAK, I2PAK, see http://www.onsemi.com/pub/Collateral/EN8586-D.PDF

Footprint

3 pads
Footprint TO-262-3_Vertical
Mount
Through hole
Courtyard
10.5 × 5 mm
Pads
3
File
2 KB

3D model

STEP

Package_TO_SOT_THT_TO-262-3_Vertical

10.01 × 4.50 × 20.73 mm

116 KB STEP

Library
Package_TO_SOT_THT_TO-262-3
Model page
Open →

Parts that use it

1 component in the catalog place this footprint

On real boards

The largest boards that carry it

DesignPartsNetsLayersBoardLicenceSource
PC771264148.59 × 177.8 mmCC-BY-4.0D10G0S1LVA/Trabalhos-Faculdade
Ion Mobility BOARD272472208 × 130 mmCC-BY-4.0Hackuarium/ion-mobility
CUNY Js54056276.2 × 106.68 mmCC-BY-4.0eaguirre12/CUNY-Js5
TP-DCI-CESE3985287 × 63 mmCC-BY-4.0sebaherrera74/DCI-KICAD
Environmental Sensor Lab NGENS SapFlowSensor2751276.2 × 106.68 mmCC-BY-4.0NextGen-Environmental-Sensor-Lab/NGENS_SapFlowSensor
EPC Hercules 2022 BOARD3219299.07 × 100 mmCC-BY-4.0MUNAKATA-EPC/Hercules_2022
EPC Hercules 2022 BOARD8159260 × 79.13 mmCC-BY-4.0MUNAKATA-EPC/Hercules_2022

Provenance

Credit
KiCad Libraries Contributors
Licence
CC-BY-SA-4.0-with-KiCad-exception