TI MicroSiP-8 SIL0008E
celestial-altium-Power_Module
MicroSIP, 8-Leads, Body 3.50x3.50mm, Pitch 0.80mm, Thermal Pad 0.00x0.00mm, IPC Medium Density
Footprint
9 pads
- Mount
- Surface mount
- Courtyard
- 4.4 × 4.1 mm
- Pads
- 9
- File
- 33 KB
3D model
noneno 3D model
This footprint names no 3D model, or names one the upstream package set never shipped. Nothing is shown rather than a model that 404s.
Provenance
- Credit
- Celestial Altium Library by Issus and contributors (https://github.com/issus/altium-library)
- Licence
- LicenseRef-Celestial-Altium