NXP_SOT1450-2_WLCSP-100_5.07x5.07mm_Layout10x10_P0.5mm

Package_CSP

5.07 × 5.07 × 0.54 mm, measured from the model's own geometry.

3D model

STEP

5.07 × 5.07 × 0.54 mm

106 KB STEP

Format: STEP
Size: 106 KB
Stored as: STEP, zstd-compressed

Footprints that name it

NXP_SOT1450-2_WLCSP-100_5.07x5.07mm_Layout10x10_P0.5mmPackage_CSP

Land patterns

Footprints this model sits on

NXP_SOT1450-2_WLCSP-100_5.07x5.07mm_Layout10x10_P0.5mm

FP3D

Package_CSP

NXP WLCSP100 (Case SOT1450-2), 0.28mm pad, 5.07x5.07mm, 100 Ball, 10x10 Layout, 0.5mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1450-2.pdf

Pads: 100
SMD: 7.1×7.1
Boards: —

Provenance

Source: kicad-packages3d
Credit: KiCad Libraries Contributors
Licence: CC-BY-SA-4.0-with-KiCad-exception