ST_WLCSP-25_Die444

Package_CSP

2.42 × 2.33 × 0.59 mm, measured from the model's own geometry.

3D model

STEP

ST_WLCSP-25_Die444

2.42 × 2.33 × 0.59 mm

32 KB STEP

Format: STEP
Size: 32 KB
Stored as: STEP, zstd-compressed

Footprints that name it

1

ST_WLCSP-25_Die444Package_CSP

Land patterns

Footprints this model sits on

ST_WLCSP-25_Die444

Package_CSP

WLCSP-25, 2.423x2.325mm, 25 Ball, 5x5 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/stm32f031k6.pdf#page=93

Pads: 25
SMD: 4.4×4.3
Boards: —

Provenance

Source: kicad-packages3d
Credit: KiCad Libraries Contributors
Licence: CC-BY-SA-4.0-with-KiCad-exception