Toshiba_11-7A9

Package_DIP

7.86 × 7.86 × 6.98 mm, measured from the model's own geometry.

3D model

STEP

Toshiba_11-7A9

7.86 × 7.86 × 6.98 mm

168 KB STEP

Format: STEP
Size: 168 KB
Stored as: STEP, zstd-compressed

Footprints that name it

Toshiba_11-7A9Package_DIP

Land patterns

Footprints this model sits on

Toshiba_11-7A9

FP3D

Package_DIP

Toshiba 11-7A9 package, like 6-lead dip package with missing pin 5, row spacing 7.62 mm (300 mils), https://toshiba.semicon-storage.com/info/docget.jsp?did=1421&prodName=TLP3021(S)

Pads: 5
THT: 9.8×8.2
Boards: —

Provenance

Source: kicad-packages3d
Credit: KiCad Libraries Contributors
Licence: CC-BY-SA-4.0-with-KiCad-exception