Texas_HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.85x4.9mm_Mask2.4x3.1mm_ThermalVias

Package_SO

5.75 × 4.90 × 1.10 mm, measured from the model's own geometry.

3D model

STEP

5.75 × 4.90 × 1.10 mm

260 KB STEP

Format: STEP
Size: 260 KB
Stored as: STEP, zstd-compressed

Footprints that name it

Texas_HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.4x3.1mm_ThermalViasPackage_SO

Land patterns

Footprints this model sits on

Texas_HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.4x3.1mm_ThermalVias

FP3D

Package_SO

8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf

Pads: 9
SMD: 8.4×5.5
Boards: 47

Provenance

Source: kicad-packages3d
Credit: KiCad Libraries Contributors
Licence: CC-BY-SA-4.0-with-KiCad-exception