Footprints
7 footprints matching “3.0”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
BGA-96_9.0x13.0mm_Layout2x3x16_P0.8mm
Package_BGA
BGA-96, http://www.mouser.com/ds/2/198/43-46TR16640B-81280BL-706483.pdf
- Pads
- 96
- SMD
- 11.0×15.0
- Boards
- 15
BGA-144_13.0x13.0mm_Layout12x12_P1.0mm
Package_BGA
BGA-144, http://www.topline.tv/drawings/pdf/BGA%201,0mm%20pitch/LBGA144T1.0-DC128.pdf
- Pads
- 144
- SMD
- 15.0×15.0
- Boards
- 1
BGA-484_23.0x23.0mm_Layout22x22_P1.0mm
Package_BGA
BGA-484, https://www.xilinx.com/support/documentation/package_specs/fg484.pdf
- Pads
- 484
- SMD
- 25.0×25.0
- Boards
- 1
BGA-1023_33.0x33.0mm_Layout32x32_P1.0mm
Package_BGA
BGA-1023
- Pads
- 1023
- SMD
- 35.0×35.0
- Boards
- —
BGA-90_8.0x13.0mm_Layout2x3x15_P0.8mm
Package_BGA
BGA-90, http://www.issi.com/WW/pdf/42-45S32800J.pdf
- Pads
- 90
- SMD
- 10.0×15.0
- Boards
- —
FB-BGA-484_23.0x23.0mm_Layout22x22_P1.0mm
Package_BGA
Xilinx FB-484, https://www.xilinx.com/support/documentation/user_guides/ug1099-bga-device-design-rules.pdf
- Pads
- 484
- SMD
- 25.0×25.0
- Boards
- —
Fujitsu_WLP-15_2.28x3.092mm_Layout3x5_P0.4mm
Package_BGA
WLP-15, 3x5 raster, 2.28x3.092mm package, pitch 0.4mm; http://www.fujitsu.com/global/documents/products/devices/semiconductor/fram/lineup/MB85RS1MT-DS501-00022-7v0-E.pdf
- Pads
- 8
- SMD
- 4.3×5.1
- Boards
- —