Footprints
4 footprints matching “2.0”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
BGA-100_12x18mm_Layout10x17_P1mm
Package_BGA
BGA-100, 12x18mm, 100 Ball, 10x17 Layout, 1mm Pitch, https://www.jedec.org/system/files/docs/MO-304D.pdf
- Pads
- 100
- SMD
- 14.0×20.0
- Boards
- —
BGA-132_12x18mm_Layout11x17_P1mm
Package_BGA
BGA-132, 12x18mm, 132 Ball, 11x17 Layout, 1mm Pitch, https://www.jedec.org/system/files/docs/MO-304D.pdf
- Pads
- 132
- SMD
- 14.0×20.0
- Boards
- —
Maxim_WLP-12_2.008x1.608mm_Layout4x3_P0.4mm
Package_BGA
Maxim WLP-12, W121H2+1, 2.008x1.608mm, 12 Ball, 4x3 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF
- Pads
- 12
- SMD
- 4.0×3.6
- Boards
- —
Texas_MicroStar_Junior_BGA-12_2.0x2.5mm_Layout4x3_P0.5mm
Package_BGA
Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf)
- Pads
- 12
- SMD
- 4.5×4.0
- Boards
- —
