Footprints
12 footprints matching “35”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
BGA-121_9.0x9.0mm_Layout11x11_P0.8mm_Ball0.4mm_Pad0.35mm_NSMD
Package_BGA
121-ball, 0.8mm BGA (based on http://www.latticesemi.com/view_document?document_id=213)
- Pads
- 121
- SMD
- 11.0×11.0
- Boards
- 9
Xilinx_CSG325
Package_BGA
Artix-7 BGA, NSMD pad definition Appendix A, 15x15mm, 324 Ball, 18x18 Layout, 0.8mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268
- Pads
- 324
- SMD
- 17.0×17.0
- Boards
- 2
ST_LFBGA-354_16x16mm_Layout19x19_P0.8mm
Package_BGA
ST LFBGA-354, 16.0x16.0mm, 354 Ball, 19x19 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf
- Pads
- 354
- SMD
- 18.0×18.0
- Boards
- 1
BGA-1156_35.0x35.0mm_Layout34x34_P1.0mm
Package_BGA
BGA-1156
- Pads
- 1156
- SMD
- 37.0×37.0
- Boards
- —
BGA-25_6.35x6.35mm_Layout5x5_P1.27mm
Package_BGA
BGA-25, https://www.analog.com/media/en/technical-documentation/data-sheets/ltm4624.pdf
- Pads
- 25
- SMD
- 8.2×8.2
- Boards
- —
BGA-352_35.0x35.0mm_Layout26x26_P1.27mm
Package_BGA
BGA-352, https://www.fujitsu.com/downloads/MICRO/fma/pdfmcu/b352p05.pdf
- Pads
- 352
- SMD
- 37.0×37.0
- Boards
- —
Microchip_FCG1152_BGA-1152_35x35mm_Layout34x34_P1.0mm
Package_BGA
FCG1152, 35.0x35.0mm, 1152 Ball, 34x34 Layout, 1.0mm Pitch, https://ww1.microchip.com/downloads/aemDocuments/documents/FPGA/ProductDocuments/UserGuides/microchip_polarfire_soc_fpga_packaging_and_pin_descriptions_user_guide_vb.pdf
- Pads
- 1152
- SMD
- 37.0×37.0
- Boards
- —
Texas_DSBGA-6_0.704x1.054mm_Layout2x3_P0.35mm
Package_BGA
Texas Instruments, DSBGA-6, 0.704x1.054mm, NSMD, YKA0006-C01 pad definition, 0.704x1.054mm, 6 Ball, 2x3 Layout, 0.35mm Pitch, https://www.ti.com/lit/ds/symlink/tps62800.pdf
- Pads
- 6
- SMD
- 2.7×3.1
- Boards
- —
Texas_DSBGA-6_0.757x1.01mm_Layout2x3_P0.35mm
Package_BGA
Texas Instruments, DSBGA-6, 0.757x1.01mm, SMD, YKA0006 pad definition, 0.757x1.01mm, 6 Ball, 2x3 Layout, 0.35mm Pitch, https://www.ti.com/lit/ds/symlink/tps62843.pdf
- Pads
- 6
- SMD
- 2.8×3.0
- Boards
- —
Texas_DSBGA-64_3.415x3.535mm_Layout8x8_P0.4mm
Package_BGA
Texas Instruments, DSBGA, area grid, 3.415x3.535mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf
- Pads
- 64
- SMD
- 5.4×5.5
- Boards
- —
TFBGA-644_19x19mm_Layout28x28_P0.65mm
Package_BGA
TFBGA-636, 19.0x19.0mm, 644 Ball, 28x28 Layout, 0.65mm Pitch, https://opensource.rock-chips.com/images/b/b6/Rockchip_RK3568_Datasheet_V1.3-20220929P.PDF
- Pads
- 644
- SMD
- 21.0×21.0
- Boards
- —
WLP-4_0.728x0.728mm_Layout2x2_P0.35mm
Package_BGA
WLP-4, 0.728x0.728mm, 4 Ball, 2x2 Layout, 0.35mm Pitch, https://datasheets.maximintegrated.com/en/ds/MAX40200.pdf
- Pads
- 4
- SMD
- 2.7×2.7
- Boards
- —