Footprints
5 footprints matching “53”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
BGA-153_8.0x8.0mm_Layout15x15_P0.5mm_Ball0.3mm_Pad0.25mm_NSMD
Package_BGA
Altera MBGA-153, https://www.altera.com/content/dam/altera-www/global/en_US/pdfs/literature/packaging/04r00471-00.pdf
- Pads
- 153
- SMD
- 10.0×10.0
- Boards
- —
FCPBGA-780_23x23mm_Layout28x28_P0.8mm
Package_BGA
FCPBGA-780, 23.0x23.0mm, 780 Ball, 28x28 Layout, 0.8mm Pitch, https://www.nxp.com/docs/en/package-information/98ASA00854D.pdf
- Pads
- 780
- SMD
- 25.0×25.0
- Boards
- —
LFBGA-153_11.5x13mm_Layout14x14_P0.5mm
Package_BGA
JEDEC eMMC AN BGA-153, 11.5x13.0mm, 153 Ball, 14x14 Layout, 0.5mm Pitch, https://www.jedec.org/sites/default/files/docs/MO-276F.pdf
- Pads
- 153
- SMD
- 13.5×15.0
- Boards
- —
Microchip_FCSG536_BGA-536_16x16mm_Layout30x30_P0.5mm
Package_BGA
FCSG536, 16.0x16.0mm, 536 Ball, 30x30 Layout, 0.5mm Pitch, https://ww1.microchip.com/downloads/aemDocuments/documents/FPGA/ProductDocuments/UserGuides/microchip_polarfire_soc_fpga_packaging_and_pin_descriptions_user_guide_vb.pdf
- Pads
- 536
- SMD
- 18.0×18.0
- Boards
- —
Texas_DSBGA-64_3.415x3.535mm_Layout8x8_P0.4mm
Package_BGA
Texas Instruments, DSBGA, area grid, 3.415x3.535mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf
- Pads
- 64
- SMD
- 5.4×5.5
- Boards
- —
