Footprints

234 footprints matching “L”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

234 footprints · page 1 of 10

Matched by name and keywords. Search by meaning instead

Lattice_caBGA-381_17x17mm_Layout20x20_P0.8mm

FP—

Package_BGA

Lattice caBGA-381, ECP5 FPGAs, 17.0x17.0mm, 381 Ball, 20x20 Layout, 0.8mm Pitch, http://www.latticesemi.com/view_document?document_id=213

Pads
381
SMD
19.0×19.0
Boards
1

LFBGA-100_10x10mm_Layout10x10_P0.8mm

FP3D

Package_BGA

LFBGA-100, 10.0x10.0mm, 100 Ball, 10x10 Layout, 0.8mm Pitch, http://www.st.com/resource/en/datasheet/stm32f103tb.pdf#page=87

Pads
100
SMD
12.0×12.0
Boards
1

LFBGA-144_10x10mm_Layout12x12_P0.8mm

FP3D

Package_BGA

LFBGA-144, 10.0x10.0mm, 144 Ball, 12x12 Layout, 0.8mm Pitch, http://www.st.com/resource/en/datasheet/stm32f103ze.pdf#page=114

Pads
144
SMD
12.0×12.0
Boards
1

Lattice_caBGA-381_17x17mm_Layout20x20_P0.8mm_SMD

FP—

Package_BGA

Lattice caBGA-381, ECP5 FPGAs, 17.0x17.0mm, 381 Ball, 20x20 Layout, 0.8mm Pitch, http://www.latticesemi.com/view_document?document_id=213

Pads
381
SMD
19.0×19.0
Boards
—

Lattice_caBGA-756_27x27mm_Layout32x32_P0.8mm

FP—

Package_BGA

Lattice caBGA-756, ECP5 FPGAs, 27.0x27.0mm, 756 Ball, 32x32 Layout, 0.8mm Pitch, http://www.latticesemi.com/view_document?document_id=213

Pads
756
SMD
29.0×29.0
Boards
—

Lattice_iCE40_csBGA-132_8x8mm_Layout14x14_P0.5mm

FP—

Package_BGA

Lattice csBGA-132, Option 2, iCE40 FPGAs, 8.0x8.0mm, 132 Ball, 14x14 Layout, 0.5mm Pitch, http://www.latticesemi.com/view_document?document_id=213

Pads
132
SMD
10.0×10.0
Boards
—

LFBGA-153_11.5x13mm_Layout14x14_P0.5mm

FP—

Package_BGA

JEDEC eMMC AN BGA-153, 11.5x13.0mm, 153 Ball, 14x14 Layout, 0.5mm Pitch, https://www.jedec.org/sites/default/files/docs/MO-276F.pdf

Pads
153
SMD
13.5×15.0
Boards
—

LFBGA-169_12x16mm_Layout14x28_P0.5mm

FP—

Package_BGA

JEDEC eMMC AA BGA-169, 12.0x16.0mm, 169 Ball, 14x28 Layout, 0.5mm Pitch, https://www.jedec.org/sites/default/files/docs/MO-276F.pdf

Pads
169
SMD
14.0×18.0
Boards
—

LFBGA-169_12x18mm_Layout14x28_P0.5mm

FP—

Package_BGA

JEDEC eMMC AB BGA-169, 12.0x18.0mm, 169 Ball, 14x28 Layout, 0.5mm Pitch, https://www.jedec.org/sites/default/files/docs/MO-276F.pdf

Pads
169
SMD
14.0×20.0
Boards
—

LFBGA-169_14x18mm_Layout14x28_P0.5mm

FP—

Package_BGA

JEDEC eMMC AC BGA-169, 14.0x18.0mm, 169 Ball, 14x28 Layout, 0.5mm Pitch, https://www.jedec.org/sites/default/files/docs/MO-276F.pdf

Pads
169
SMD
16.0×20.0
Boards
—

LFBGA-289_14x14mm_Layout17x17_P0.8mm

FP—

Package_BGA

LFBGA-289, 14.0x14.0mm, 289 Ball, 17x17 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp131c.pdf

Pads
289
SMD
16.0×16.0
Boards
—

LFBGA-400_16x16mm_Layout20x20_P0.8mm

FP—

Package_BGA

LFBGA-400, NSMD, 16.0x16.0mm, 400 Ball, 20x20 Layout, 0.8mm Pitch, https://www.efinixinc.com/docs/titanium-packaging-ug-v5.2.pdf

Pads
400
SMD
18.0×18.0
Boards
—

LFBGA-484_18x18mm_Layout22x22_P0.8mm

FP—

Package_BGA

LFBGA-484, NSMD, 18.0x18.0mm, 484 Ball, 22x22 Layout, 0.8mm Pitch, https://www.efinixinc.com/docs/titanium-packaging-ug-v5.2.pdf

Pads
484
SMD
20.0×20.0
Boards
—

Linear_BGA-133_15.0x15.0mm_Layout12x12_P1.27mm

FP—

Package_BGA

Analog Devices (Linear Tech), 133-pin BGA uModule, 15.0x15.0x4.92mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf

Pads
134
SMD
17.0×17.0
Boards
—

BGA-256_14.0x14.0mm_Layout16x16_P0.8mm_Ball0.45mm_Pad0.32mm_NSMD

FP3D

Package_BGA

BGA-256, dimensions: https://www.xilinx.com/support/documentation/package_specs/ft256.pdf, design rules: https://www.xilinx.com/support/documentation/user_guides/ug1099-bga-device-design-rules.pdf

Pads
256
SMD
16.0×16.0
Boards
23

BGA-96_9.0x13.0mm_Layout2x3x16_P0.8mm

FP3D

Package_BGA

BGA-96, http://www.mouser.com/ds/2/198/43-46TR16640B-81280BL-706483.pdf

Pads
96
SMD
11.0×15.0
Boards
15

WLP-4_0.86x0.86mm_P0.4mm

FP3D

Package_BGA

WLP-4_0.86x0.86mm_P0.4mm https://pdfserv.maximintegrated.com/package_dwgs/21-0612.PDF, https://www.maximintegrated.com/en/app-notes/index.mvp/id/1891

Pads
4
SMD
2.9×2.9
Boards
12

Xilinx_FTG256

FP—

Package_BGA

Artix-7 BGA, NSMD pad definition Appendix A, 17x17mm, 256 Ball, 16x16 Layout, 1mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=269

Pads
256
SMD
19.0×19.0
Boards
12

BGA-121_9.0x9.0mm_Layout11x11_P0.8mm_Ball0.4mm_Pad0.35mm_NSMD

FP3D

Package_BGA

121-ball, 0.8mm BGA (based on http://www.latticesemi.com/view_document?document_id=213)

Pads
121
SMD
11.0×11.0
Boards
9

TFBGA-100_8x8mm_Layout10x10_P0.8mm

FP3D

Package_BGA

TFBGA-100, 8.0x8.0mm, 100 Ball, 10x10 Layout, 0.8mm Pitch, http://www.st.com/resource/en/datasheet/stm32f746zg.pdf#page=199

Pads
100
SMD
10.0×10.0
Boards
8

BGA-256_17.0x17.0mm_Layout16x16_P1.0mm_Ball0.5mm_Pad0.4mm_NSMD

FP3D

Package_BGA

BGA-256, dimensions: https://www.xilinx.com/support/documentation/package_specs/ft256.pdf, design rules: https://www.xilinx.com/support/documentation/user_guides/ug1099-bga-device-design-rules.pdf

Pads
256
SMD
19.0×19.0
Boards
5

Micron_FBGA-96_9x14mm_Layout9x16_P0.8mm

FP—

Package_BGA

FBGA-96, 9.0x14.0mm, 96 Ball, 9x16 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=26

Pads
96
SMD
11.0×16.0
Boards
4

Texas_DSBGA-9_1.62x1.58mm_Layout3x3_P0.5mm

FP—

Package_BGA

Texas Instruments, DSBGA, 1.62mmx1.58mm, area grid, NSMD, YZF0009 pad definition, 1.62x1.58mm, 9 Ball, 3x3 Layout, 0.5mm Pitch, https://www.ti.com/lit/ml/mxbg027n/mxbg027n.pdf

Pads
9
SMD
3.6×3.6
Boards
4

Texas_DSBGA-6_0.95x1.488mm_Layout2x3_P0.4mm

FP—

Package_BGA

Texas Instruments, DSBGA, area grid, YBG pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf

Pads
6
SMD
3.0×3.5
Boards
3