Footprints
16 footprints matching “0.35”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
ST_WLCSP-101_3.86x3.79mm_Layout11x19_P0.35mm_Stagger
Package_CSP
ST WLCSP-101, ST Die ID 485, 3.86x3.79mm, 101 Ball, Y-staggered 11x19 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7r3v8.pdf
- Pads
- 101
- SMD
- 5.9×5.8
- Boards
- —
ST_WLCSP-115_3.73x4.15mm_Layout11x21_P0.35mm_Stagger
Package_CSP
ST WLCSP-115, ST die ID 483, 3.73x4.15mm, 115 Ball, Y-staggered 11x21 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h725vg.pdf
- Pads
- 115
- SMD
- 5.7×6.2
- Boards
- —
ST_WLCSP-12_1.7x1.42mm_Layout4x6_P0.35mm_Stagger
Package_CSP
ST WLCSP-12, ST Die ID 443, 1.7x1.42mm, 12 Ball, Y-staggered 4x6 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32c011d6.pdf
- Pads
- 12
- SMD
- 3.7×3.4
- Boards
- —
ST_WLCSP-132_4.57x4.37mm_Layout12x11_P0.35mm
Package_CSP
ST WLCSP-132, ST die ID 480, 4.57x4.37mm, 132 Ball, 12x11 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7a3ai.pdf
- Pads
- 132
- SMD
- 6.6×6.4
- Boards
- —
ST_WLCSP-156_4.96x4.64mm_Layout13x12_P0.35mm
Package_CSP
ST WLCSP-156, ST die ID 450, 4.96x4.64mm, 156 Ball, 13x12 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h747xi.pdf
- Pads
- 156
- SMD
- 7.0×6.6
- Boards
- —
ST_WLCSP-19_1.643x2.492mm_Layout4x11_P0.35mm_Stagger
Package_CSP
ST WLCSP-19, ST Die ID 493, 1.643x2.492mm, 19 Ball, Y-staggered 4x11 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32c071kb.pdf#page=101
- Pads
- 19
- SMD
- 3.7×4.5
- Boards
- —
ST_WLCSP-208_5.38x5.47mm_Layout26x16_P0.35mm_Stagger
Package_CSP
ST WLCSP-208, ST die ID 481, 5.38x5.47mm, 208 Ball, X-staggered 26x16 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32u5a5aj.pdf
- Pads
- 208
- SMD
- 7.4×7.5
- Boards
- —
ST_WLCSP-208_5.8x5.6mm_Layout26x16_P0.35mm_Stagger
Package_CSP
ST WLCSP-208, ST die ID 476, 5.8x5.6mm, 208 Ball, X-staggered 26x16 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32u5f9bj.pdf
- Pads
- 208
- SMD
- 7.8×7.6
- Boards
- —
ST_WLCSP-64_Die435
Package_CSP
WLCSP-64, 3.141x3.127mm, 64 Ball, 8x8 Layout, 0.35mm Pitch, http://www.st.com/resource/en/datasheet/DM00257211.pdf#page=188
- Pads
- 64
- SMD
- 5.2×5.1
- Boards
- —
ST_WLCSP-72_3.38x3.38mm_Layout16x9_P0.35mm_Stagger
Package_CSP
ST WLCSP-72, ST die ID 455, 3.38x3.38mm, 72 Ball, X-staggered 16x9 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32u535je.pdf
- Pads
- 72
- SMD
- 5.4×5.4
- Boards
- —
ST_WLCSP-80_3.5x3.27mm_Layout10x16_P0.35mm_Stagger_Offcenter
Package_CSP
ST WLCSP-80, ST die ID 484, 3.5x3.27mm, 80 Ball, Y-staggered 10x16 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h563mi.pdf
- Pads
- 80
- SMD
- 5.5×5.3
- Boards
- —
ST_WLCSP-99_4.42x3.77mm_Layout11x9_P0.35mm
Package_CSP
ST WLCSP-99, ST die ID 415, 4.42x3.77mm, 99 Ball, 11x9 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32l476vg.pdf
- Pads
- 99
- SMD
- 6.4×5.8
- Boards
- —
WLCSP-16_1.409x1.409mm_Layout4x4_P0.35mm
Package_CSP
WLCSP-16, 1.409x1.409mm, 16 Ball, 4x4 Layout, 0.35mm Pitch, http://www.latticesemi.com/view_document?document_id=213
- Pads
- 16
- SMD
- 3.4×3.4
- Boards
- —
WLCSP-36_2.374x2.459mm_Layout6x6_P0.35mm
Package_CSP
WLCSP-36, https://www.nxp.com/docs/en/package-information/98ASA00604D.pdf
- Pads
- 36
- SMD
- 4.6×4.6
- Boards
- —
WLCSP-4_0.64x0.64mm_Layout2x2_P0.35mm
Package_CSP
WLCSP-4, 0.64x0.64mm, 4 Ball, 2x2 Layout, 0.35mm Pitch, https://www.onsemi.com/pdf/datasheet/ncp163-d.pdf#page=23
- Pads
- 4
- SMD
- 2.6×2.6
- Boards
- —
WLCSP-8_1.58x1.63x0.35mm_Layout3x5_P0.35x0.4mm_Ball0.25mm_Pad0.25mm_NSMD
Package_CSP
WLCSP/XFBGA 8-pin package, staggered pins, http://www.adestotech.com/wp-content/uploads/DS-AT25DF041B_040.pdf
- Pads
- 8
- SMD
- 3.6×3.7
- Boards
- —