Footprints
3 footprints matching “0.8”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
Nexperia_WLCSP-15_2.37x1.17mm_Layout6x3_P0.4mmP0.8mm
FP—
Package_CSP
Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf
- Pads
- 15
- SMD
- 4.4×3.2
- Boards
- —
WLCSP-4_0.89x0.89mm_Layout2x2_P0.5mm
FP—
Package_CSP
X1-WLB0909-4, 0.89x0.89mm, 4 Ball, 2x2 Layout, 0.5mm Pitch, https://www.diodes.com/assets/Datasheets/AP22913.pdf
- Pads
- 4
- SMD
- 2.9×2.9
- Boards
- —
Xilinx_CSG48_7.0x7.0mm_Layout7x7_P0.8mm
FP3D
Package_CSP
XC9572XL CS BGA, 7x7mm, 48 Ball, 7x7 Layout, 0.8mm Pitch, https://www.xilinx.com/content/dam/xilinx/support/documents/package_specs/cs48.pdf
- Pads
- 48
- SMD
- 9.0×9.0
- Boards
- —
