Footprints
10 footprints matching “13”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
OnSemi_ODCSP36_BGA-36_6.13x6.13mm_Layout6x6_P1.0mm
Package_CSP
OnSemi ODCSP36 (Case 570CP), 0.27mm pad, 6.13x6.13mm, 36 Ball, 6x6 Layout, 1.0mm Pitch, https://www.onsemi.com/pub/Collateral/570CP.PDF
- Pads
- 36
- SMD
- 8.1×8.1
- Boards
- —
OnSemi_ODCSP36_BGA-36_6.13x6.13mm_Layout6x6_P1.0mm_ManualAssembly
Package_CSP
OnSemi ODCSP36 (Case 570CP), 0.47mm pad, manual assembly variant (larger pads), 6.13x6.13mm, 36 Ball, 6x6 Layout, 1.0mm Pitch, https://www.onsemi.com/pub/Collateral/570CP.PDF
- Pads
- 36
- SMD
- 8.1×8.1
- Boards
- —
ST_WLCSP-132_4.57x4.37mm_Layout12x11_P0.35mm
Package_CSP
ST WLCSP-132, ST die ID 480, 4.57x4.37mm, 132 Ball, 12x11 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7a3ai.pdf
- Pads
- 132
- SMD
- 6.6×6.4
- Boards
- —
ST_WLCSP-150_5.38x5.47mm_Layout13x23_P0.4mm_Stagger
Package_CSP
ST WLCSP-150, ST die ID 481, 5.38x5.47mm, 150 Ball, Y-staggered 13x23 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u595zj.pdf
- Pads
- 150
- SMD
- 7.4×7.5
- Boards
- —
ST_WLCSP-156_4.96x4.64mm_Layout13x12_P0.35mm
Package_CSP
ST WLCSP-156, ST die ID 450, 4.96x4.64mm, 156 Ball, 13x12 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h747xi.pdf
- Pads
- 156
- SMD
- 7.0×6.6
- Boards
- —
ST_WLCSP-36_2.83x2.99mm_Layout7x13_P0.4mm_Stagger_Offcenter
Package_CSP
ST WLCSP-36, ST Die ID 032, 2.83x2.99mm, 36 Ball, Y-staggered 7x13 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb09te.pdf#page=59
- Pads
- 36
- SMD
- 4.8×5.0
- Boards
- —
ST_WLCSP-41_2.98x2.76mm_Layout13x7_P0.4mm_Stagger
Package_CSP
ST WLCSP-41, 2.98x2.76mm, 41 Ball, X-staggered 13x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wba55hg.pdf#page=140
- Pads
- 41
- SMD
- 5.0×4.8
- Boards
- —
ST_WLCSP-49_3.15x3.13mm_Layout7x7_P0.4mm
Package_CSP
ST WLCSP-49, ST die ID 468, 3.15x3.13mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g431c6.pdf
- Pads
- 49
- SMD
- 5.2×5.1
- Boards
- —
ST_WLCSP-52_3.09x3.15mm_Layout13x8_P0.4mm_Stagger
Package_CSP
ST WLCSP-52, ST die ID 467, 3.09x3.15mm, 52 Ball, X-staggered 13x8 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g0b1ne.pdf#page=136
- Pads
- 52
- SMD
- 5.1×5.2
- Boards
- —
ST_WLCSP-90_Die413
Package_CSP
WLCSP-90, 4.223x3.969mm, 90 Ball, 10x9 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/stm32f405og.pdf#page=164
- Pads
- 90
- SMD
- 6.2×6.0
- Boards
- —