Footprints
11 footprints matching “15”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
WLCSP-12_1.56x1.56mm_P0.4mm
Package_CSP
WLCSP 12 1.56x1.56 https://ae-bst.resource.bosch.com/media/_tech/media/datasheets/BST-BMM150-DS001-01.pdf
- Pads
- 12
- SMD
- 2.1×2.1
- Boards
- 9
LFCSP-72-1EP_10x10mm_P0.5mm_EP6.15x6.15mm
Package_CSP
72-Lead Frame Chip Scale Package - 10x10x0.9 mm Body [LFCSP]; (see https://www.intersil.com/content/dam/Intersil/documents/l72_/l72.10x10c.pdf)
- Pads
- 73
- SMD
- 10.9×10.9
- Boards
- —
Nexperia_WLCSP-15_2.37x1.17mm_Layout6x3_P0.4mmP0.8mm
Package_CSP
Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf
- Pads
- 15
- SMD
- 4.4×3.2
- Boards
- —
ST_WLCSP-115_3.73x4.15mm_Layout11x21_P0.35mm_Stagger
Package_CSP
ST WLCSP-115, ST die ID 483, 3.73x4.15mm, 115 Ball, Y-staggered 11x21 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h725vg.pdf
- Pads
- 115
- SMD
- 5.7×6.2
- Boards
- —
ST_WLCSP-115_4.63x4.15mm_Layout21x11_P0.4mm_Stagger
Package_CSP
ST WLCSP-115, ST die ID 461, 4.63x4.15mm, 115 Ball, X-staggered 21x11 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l496wg.pdf
- Pads
- 115
- SMD
- 6.6×6.2
- Boards
- —
ST_WLCSP-150_5.38x5.47mm_Layout13x23_P0.4mm_Stagger
Package_CSP
ST WLCSP-150, ST die ID 481, 5.38x5.47mm, 150 Ball, Y-staggered 13x23 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u595zj.pdf
- Pads
- 150
- SMD
- 7.4×7.5
- Boards
- —
ST_WLCSP-156_4.96x4.64mm_Layout13x12_P0.35mm
Package_CSP
ST WLCSP-156, ST die ID 450, 4.96x4.64mm, 156 Ball, 13x12 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h747xi.pdf
- Pads
- 156
- SMD
- 7.0×6.6
- Boards
- —
ST_WLCSP-49_3.15x3.13mm_Layout7x7_P0.4mm
Package_CSP
ST WLCSP-49, ST die ID 468, 3.15x3.13mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g431c6.pdf
- Pads
- 49
- SMD
- 5.2×5.1
- Boards
- —
ST_WLCSP-52_3.09x3.15mm_Layout13x8_P0.4mm_Stagger
Package_CSP
ST WLCSP-52, ST die ID 467, 3.09x3.15mm, 52 Ball, X-staggered 13x8 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g0b1ne.pdf#page=136
- Pads
- 52
- SMD
- 5.1×5.2
- Boards
- —
ST_WLCSP-72_Die415
Package_CSP
WLCSP-72, 4.4084x3.7594mm, 72 Ball, 9x9 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/stm32l476me.pdf#page=255
- Pads
- 72
- SMD
- 6.4×5.8
- Boards
- —
ST_WLCSP-81_Die415
Package_CSP
WLCSP-81, 4.4084x3.7594mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/stm32l476me.pdf#page=252
- Pads
- 81
- SMD
- 6.4×5.8
- Boards
- —