Footprints
26 footprints matching “6mm”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
WLCSP-12_1.56x1.56mm_P0.4mm
Package_CSP
WLCSP 12 1.56x1.56 https://ae-bst.resource.bosch.com/media/_tech/media/datasheets/BST-BMM150-DS001-01.pdf
- Pads
- 12
- SMD
- 2.1×2.1
- Boards
- 9
LFCSP-32-1EP_5x5mm_P0.5mm_EP3.6x3.6mm
Package_CSP
LFCSP, 32 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ADV7280.PDF#page=28)
- Pads
- 33
- SMD
- 6.3×6.3
- Boards
- 5
LFCSP-6-1EP_2x2mm_P0.65mm_EP1x1.6mm
Package_CSP
LFCSP, 6 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-6/cp_6_3.pdf)
- Pads
- 7
- SMD
- 3.3×2.5
- Boards
- 2
LFCSP-16-1EP_3x3mm_P0.5mm_EP1.6x1.6mm
Package_CSP
LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/CP_16_22.pdf)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- 1
LFCSP-16-1EP_3x3mm_P0.5mm_EP1.6x1.6mm_ThermalVias
Package_CSP
LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/CP_16_22.pdf)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- 1
LFCSP-32-1EP_5x5mm_P0.5mm_EP3.6x3.6mm_ThermalVias
Package_CSP
LFCSP, 32 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ADV7280.PDF#page=28)
- Pads
- 33
- SMD
- 6.3×6.3
- Boards
- 1
Analog_LFCSP-UQ-10_1.3x1.6mm_P0.4mm
Package_CSP
Analog LFCSP-UQ, 10 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_10_10.pdf)
- Pads
- 10
- SMD
- 2.5×2.8
- Boards
- —
Dialog_WLCSP-34_4.54x1.66mm_Layout17x4_P0.25x0.34mm
Package_CSP
Dialog Semiconductor (Renesas) WLCSP-34, staggered array, 4.54x1.66mm, 34 Ball, 17x4 Layout, 0.25x0.34mm Pitch, https://www.renesas.com/us/en/document/dst/da7212-datasheet
- Pads
- 34
- SMD
- 6.5×3.7
- Boards
- —
LFCSP-16-1EP_4x4mm_P0.65mm_EP2.6x2.6mm
Package_CSP
LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/cp_16_17.pdf)
- Pads
- 17
- SMD
- 5.3×5.3
- Boards
- —
LFCSP-16-1EP_4x4mm_P0.65mm_EP2.6x2.6mm_ThermalVias
Package_CSP
LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/cp_16_17.pdf)
- Pads
- 17
- SMD
- 5.3×5.3
- Boards
- —
LFCSP-20-1EP_4x4mm_P0.5mm_EP2.6x2.6mm
Package_CSP
LFCSP, 20 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-20/CP_20_8.pdf)
- Pads
- 21
- SMD
- 5.3×5.3
- Boards
- —
LFCSP-20-1EP_4x4mm_P0.5mm_EP2.6x2.6mm_ThermalVias
Package_CSP
LFCSP, 20 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-20/CP_20_8.pdf)
- Pads
- 21
- SMD
- 5.3×5.3
- Boards
- —
LFCSP-40-1EP_6x6mm_P0.5mm_EP3.9x3.9mm
Package_CSP
LFCSP, 40 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_40_14.pdf)
- Pads
- 41
- SMD
- 7.3×7.3
- Boards
- —
LFCSP-40-1EP_6x6mm_P0.5mm_EP3.9x3.9mm_ThermalVias
Package_CSP
LFCSP, 40 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_40_14.pdf)
- Pads
- 41
- SMD
- 7.3×7.3
- Boards
- —
LFCSP-40-1EP_6x6mm_P0.5mm_EP4.65x4.65mm
Package_CSP
LFCSP, 40 Pin (https://www.jedec.org/system/files/docs/MO-220K01.pdf (variation VJJD-5))
- Pads
- 41
- SMD
- 7.3×7.3
- Boards
- —
LFCSP-40-1EP_6x6mm_P0.5mm_EP4.65x4.65mm_ThermalVias
Package_CSP
LFCSP, 40 Pin (https://www.jedec.org/system/files/docs/MO-220K01.pdf (variation VJJD-5))
- Pads
- 41
- SMD
- 7.3×7.3
- Boards
- —
LFCSP-40-1EP_6x6mm_P0.5mm_EP4.6x4.6mm
Package_CSP
LFCSP, 40 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-40/CP_40_15.pdf)
- Pads
- 41
- SMD
- 7.3×7.3
- Boards
- —
LFCSP-40-1EP_6x6mm_P0.5mm_EP4.6x4.6mm_ThermalVias
Package_CSP
LFCSP, 40 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-40/CP_40_15.pdf)
- Pads
- 41
- SMD
- 7.3×7.3
- Boards
- —
LFCSP-56-1EP_8x8mm_P0.5mm_EP6.6x6.6mm
Package_CSP
LFCSP, 56 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-56/CP_56_9.pdf)
- Pads
- 57
- SMD
- 9.3×9.3
- Boards
- —
LFCSP-56-1EP_8x8mm_P0.5mm_EP6.6x6.6mm_ThermalVias
Package_CSP
LFCSP, 56 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-56/CP_56_9.pdf)
- Pads
- 57
- SMD
- 9.3×9.3
- Boards
- —
OnSemi_ODCSP8_BGA-8_3.16x3.16mm_Layout3x3_P1.26mm
Package_CSP
OnSemi ODCSP8 (Case 570CS), 0.27mm pad, 3.16x3.16mm, 8 Ball, 3x3 Layout, 1.26mm Pitch, https://www.onsemi.com/pub/Collateral/570CS.PDF
- Pads
- 8
- SMD
- 5.2×5.2
- Boards
- —
OnSemi_ODCSP8_BGA-8_3.16x3.16mm_Layout3x3_P1.26mm_ManualAssembly
Package_CSP
OnSemi ODCSP8 (Case 570CS), 0.46mm pad, manual assembly variant (larger pads), 3.16x3.16mm, 8 Ball, 3x3 Layout, 1.26mm Pitch, https://www.onsemi.com/pub/Collateral/570CS.PDF
- Pads
- 8
- SMD
- 5.2×5.2
- Boards
- —
ST_WLCSP-100_4.437x4.456mm_Layout10x10_P0.4mm
Package_CSP
ST WLCSP-100, ST die ID 471, 4.437x4.456mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l4p5ve.pdf
- Pads
- 100
- SMD
- 6.4×6.5
- Boards
- —
ST_WLCSP-208_5.8x5.6mm_Layout26x16_P0.35mm_Stagger
Package_CSP
ST WLCSP-208, ST die ID 476, 5.8x5.6mm, 208 Ball, X-staggered 26x16 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32u5f9bj.pdf
- Pads
- 208
- SMD
- 7.8×7.6
- Boards
- —