Footprints

56 footprints matching “7”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

56 footprints · page 1 of 3

Matched by name and keywords. Search by meaning instead

LFCSP-8-1EP_3x3mm_P0.5mm_EP1.45x1.74mm

FP3D

Package_CSP

LFCSP, 8 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-8/CP_8_13.pdf)

Pads: 9
SMD: 4.3×3.5
Boards: 2

LFCSP-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm

FP3D

Package_CSP

LFCSP, 16 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/HMC7992.pdf)

Pads: 17
SMD: 4.3×4.3
Boards: 1

LFCSP-48-1EP_7x7mm_P0.5mm_EP4.1x4.1mm

FP—

Package_CSP

LFCSP, 48 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_48_5.pdf)

Pads: 49
SMD: 8.2×8.2
Boards: 1

LFCSP-48-1EP_7x7mm_P0.5mm_EP4.1x4.1mm_ThermalVias

FP—

Package_CSP

LFCSP, 48 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_48_5.pdf)

Pads: 49
SMD: 8.2×8.2
Boards: 1

LFCSP-72-1EP_10x10mm_P0.5mm_EP5.3x5.3mm

FP—

Package_CSP

LFCSP, 72 Pin (http://www.analog.com/media/en/technical-documentation/data-sheets/ADAU1452_1451_1450.pdf)

Pads: 73
SMD: 11.3×11.3
Boards: 1

ST_WLCSP-49_Die447

FP—

Package_CSP

WLCSP-49, 3.294x3.258mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/stm32l072kz.pdf#page=134

Pads: 49
SMD: 5.3×5.3
Boards: 1

Anpec_WLCSP-20_1.76x2.03mm_Layout4x5_P0.4mm

FP—

Package_CSP

WLCSP-20, 1.76x2.03mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, https://www.lcsc.com/datasheet/lcsc_datasheet_2007032014_Anpec-Elec-APW7261HAI-TRG_C691404.pdf

Pads: 20
SMD: 3.8×4.0
Boards: —

Dialog_WLCSP-34_4.54x1.66mm_Layout17x4_P0.25x0.34mm

FP—

Package_CSP

Dialog Semiconductor (Renesas) WLCSP-34, staggered array, 4.54x1.66mm, 34 Ball, 17x4 Layout, 0.25x0.34mm Pitch, https://www.renesas.com/us/en/document/dst/da7212-datasheet

Pads: 34
SMD: 6.5×3.7
Boards: —

DiodesInc_GEA20_WLCSP-20_1.7x2.1mm_Layout4x5_P0.4mm

FP3D

Package_CSP

Diodes Incorporated WLCSP-20, GEA20, 1.7x2.1mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, https://www.diodes.com/assets/Package-Files/GEA20.pdf

Pads: 20
SMD: 3.7×4.1
Boards: —

Efinix_WLCSP-64_3.5353x3.3753mm_Layout8x8_P0.4mm

FP—

Package_CSP

Efinix WLCSP, NSMD pad definition Page 60, 3.5353x3.3753mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, https://www.efinixinc.com/docs/titanium-packaging-ug-v5.2.pdf#page=9

Pads: 64
SMD: 5.5×5.4
Boards: —

Efinix_WLCSP-80_4.4567x3.5569mm_Layout10x8_P0.4mm

FP—

Package_CSP

WLCSP-80, NSMD pad definition Page 54, 4.4567x3.5569mm, 80 Ball, 10x8 Layout, 0.4mm Pitch, https://www.efinixinc.com/docs/trion-packaging-ug-v4.9.pdf

Pads: 80
SMD: 6.5×5.6
Boards: —

LFCSP-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm_ThermalVias

FP3D

Package_CSP

LFCSP, 16 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/HMC7992.pdf)

Pads: 17
SMD: 4.3×4.3
Boards: —

LFCSP-72-1EP_10x10mm_P0.5mm_EP5.3x5.3mm_ThermalVias

FP—

Package_CSP

LFCSP, 72 Pin (http://www.analog.com/media/en/technical-documentation/data-sheets/ADAU1452_1451_1450.pdf)

Pads: 73
SMD: 11.3×11.3
Boards: —

LFCSP-72-1EP_10x10mm_P0.5mm_EP6.15x6.15mm

FP—

Package_CSP

72-Lead Frame Chip Scale Package - 10x10x0.9 mm Body [LFCSP]; (see https://www.intersil.com/content/dam/Intersil/documents/l72_/l72.10x10c.pdf)

Pads: 73
SMD: 10.9×10.9
Boards: —

LFCSP-VQ-48-1EP_7x7mm_P0.5mm

FP—

Package_CSP

LFCSP VQ, 48 pin, exposed pad, 7x7mm body (http://www.analog.com/media/en/technical-documentation/data-sheets/AD7951.pdf, http://www.analog.com/en/design-center/packaging-quality-symbols-footprints/symbols-and-footprints/AD7951.html)

Pads: 49
SMD: 8.1×8.1
Boards: —

Maxim_WLCSP-35_2.998x2.168mm_Layout7x5_P0.4mm

FP—

Package_CSP

WLCSP-35, 2.998x2.168mm, 35 Ball, 7x5 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100489.PDF

Pads: 35
SMD: 5.0×4.2
Boards: —

Nexperia_WLCSP-15_2.37x1.17mm_Layout6x3_P0.4mmP0.8mm

FP—

Package_CSP

Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf

Pads: 15
SMD: 4.4×3.2
Boards: —

NXP_SOT1444-5_WLCSP-49_3.44x3.44mm_Layout7x7_P0.4mm

FP3D

Package_CSP

NXP WLCSP49 (Case SOT1444-5), 0.24mm pad, 3.44x3.44mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1444-5.pdf

Pads: 49
SMD: 5.4×5.4
Boards: —

NXP_SOT1450-2_WLCSP-100_5.07x5.07mm_Layout10x10_P0.5mm

FP3D

Package_CSP

NXP WLCSP100 (Case SOT1450-2), 0.28mm pad, 5.07x5.07mm, 100 Ball, 10x10 Layout, 0.5mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1450-2.pdf

Pads: 100
SMD: 7.1×7.1
Boards: —