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Footprints

1 footprints matching “Nexperia”

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Nexperia_WLCSP-15_2.37x1.17mm_Layout6x3_P0.4mmP0.8mm

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Package_CSP

Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf

Pads
15
SMD
4.4×3.2
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33,628 components · 25,832 3D models · 55181 reference designs