Footprints
264 footprints
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
QFN-40-1EP_5x5mm_P0.4mm_EP3.6x3.6mm
Package_DFN_QFN
QFN, 40 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=297)
- Pads
- 41
- SMD
- 6.2×6.2
- Boards
- 18
DFN-10-1EP_3x3mm_P0.5mm_EP1.65x2.38mm
Package_DFN_QFN
DFN, 10 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/lt3471.pdf#page=15)
- Pads
- 11
- SMD
- 4.3×3.5
- Boards
- 17
OnSemi_XDFN4-1EP_1.0x1.0mm_EP0.52x0.52mm
Package_DFN_QFN
XDFN4 footprint (as found on the https://www.onsemi.com/pub/Collateral/NCP115-D.PDF)
- Pads
- 5
- SMD
- 1.7×1.5
- Boards
- 17
QFN-16-1EP_4x4mm_P0.65mm_EP2.5x2.5mm
Package_DFN_QFN
QFN, 16 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=266)
- Pads
- 17
- SMD
- 5.2×5.2
- Boards
- 15
QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm
Package_DFN_QFN
QFN, 32 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/00002164B.pdf#page=68)
- Pads
- 33
- SMD
- 6.3×6.3
- Boards
- 15
QFN-40-1EP_5x5mm_P0.4mm_EP3.6x3.6mm_ThermalVias
Package_DFN_QFN
QFN, 40 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=297)
- Pads
- 41
- SMD
- 6.2×6.2
- Boards
- 15
UQFN-10_1.4x1.8mm_P0.4mm
Package_DFN_QFN
UQFN, 10 Pin (https://www.onsemi.com/pub/Collateral/488AT.PDF)
- Pads
- 10
- SMD
- 2.6×3.0
- Boards
- 15
DFN-14-1EP_3x3mm_P0.4mm_EP1.78x2.35mm
Package_DFN_QFN
DD Package; 14-Lead Plastic DFN (3mm x 3mm) (http://pdfserv.maximintegrated.com/land_patterns/90-0063.PDF)
- Pads
- 15
- SMD
- 4.0×3.6
- Boards
- 14
QFN-28-1EP_5x5mm_P0.5mm_EP3.35x3.35mm_ThermalVias
Package_DFN_QFN
QFN, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=283)
- Pads
- 29
- SMD
- 6.2×6.2
- Boards
- 14
QFN-28-1EP_6x6mm_P0.65mm_EP4.8x4.8mm
Package_DFN_QFN
QFN, 28 Pin (https://semtech.my.salesforce.com/sfc/p/#E0000000JelG/a/440000001NCE/v_VBhk1IolDgxwwnOpcS_vTFxPfSEPQbuneK3mWsXlU page=125)
- Pads
- 29
- SMD
- 7.3×7.3
- Boards
- 14
DFN-8-1EP_2x3mm_P0.5mm_EP0.61x2.2mm
Package_DFN_QFN
DFN, 8 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-dfn/05081702_c_ddb8.pdf)
- Pads
- 9
- SMD
- 3.3×3.5
- Boards
- 13
QFN-24-1EP_3x3mm_P0.4mm_EP1.75x1.6mm
Package_DFN_QFN
QFN, 24 Pin (https://www.invensense.com/wp-content/uploads/2015/02/PS-MPU-9250A-01-v1.1.pdf#page=39)
- Pads
- 25
- SMD
- 4.3×4.3
- Boards
- 13
QFN-40-1EP_6x6mm_P0.5mm_EP4.6x4.6mm
Package_DFN_QFN
QFN, 40 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=295)
- Pads
- 41
- SMD
- 7.2×7.2
- Boards
- 13
QFN-44-1EP_7x7mm_P0.5mm_EP5.15x5.15mm
Package_DFN_QFN
QFN, 44 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_44_05-08-1763.pdf)
- Pads
- 45
- SMD
- 8.3×8.3
- Boards
- 13
QFN-20-1EP_4x4mm_P0.5mm_EP2.5x2.5mm_ThermalVias
Package_DFN_QFN
QFN, 20 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=274)
- Pads
- 21
- SMD
- 5.2×5.2
- Boards
- 12
UDFN-4-1EP_1x1mm_P0.65mm_EP0.48x0.48mm
Package_DFN_QFN
UDFN-4_1x1mm_P0.65mm, http://ww1.microchip.com/downloads/en/DeviceDoc/MIC550x-300mA-Single-Output-LDO-in-Small-Packages-DS20006006A.pdf
- Pads
- 5
- SMD
- 1.8×1.5
- Boards
- 12
DFN-10-1EP_3x3mm_P0.5mm_EP1.55x2.48mm
Package_DFN_QFN
10-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 11
- SMD
- 4.3×3.7
- Boards
- 11
AO_DFN-8-1EP_5.55x5.2mm_P1.27mm_EP4.12x4.6mm
Package_DFN_QFN
DD Package; 8-Lead Plastic DFN (5.55mm x 5.2mm), Pin 5-8 connected to EP (http://www.aosmd.com/res/packaging_information/DFN5x6_8L_EP1_P.pdf)
- Pads
- 5
- SMD
- 6.7×5.7
- Boards
- 10
DFN-6-1EP_3x3mm_P0.95mm_EP1.7x2.6mm
Package_DFN_QFN
DFN6 3*3 MM, 0.95 PITCH; CASE 506AH-01 (see ON Semiconductor 506AH.PDF)
- Pads
- 7
- SMD
- 3.8×3.7
- Boards
- 10
QFN-32-1EP_4x4mm_P0.4mm_EP2.9x2.9mm
Package_DFN_QFN
QFN, 32 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/atmel-8153-8-and-16-bit-avr-microcontroller-xmega-e-atxmega8e5-atxmega16e5-atxmega32e5_datasheet.pdf#page=70)
- Pads
- 33
- SMD
- 5.2×5.2
- Boards
- 10
DFN-6-1EP_2x2mm_P0.5mm_EP0.61x1.42mm
Package_DFN_QFN
DC6 Package; 6-Lead Plastic DFN (2mm x 2mm) (see Linear Technology DFN_6_05-08-1703.pdf)
- Pads
- 7
- SMD
- 3.1×2.6
- Boards
- 9
DFN-8_2x2mm_P0.5mm
Package_DFN_QFN
DFN8 2x2, 0.5P; No exposed pad - Ref http://pdfserv.maximintegrated.com/land_patterns/90-0349.PDF
- Pads
- 8
- SMD
- 3.3×2.7
- Boards
- 9
PQFN-8-EP_6x5mm_P1.27mm_Generic
Package_DFN_QFN
Universal Footprint for Thermally-enhanced SO-8 packages; compatible with Vishay PowerPAK SO−8, International Rectifier PQFN, Texas Instrument SON 5 × 6 mm (Q5A), Alpha and Omega DFN 5 × 6, ST Microelectronics PowerFLAT™ 5 × 6, Toshiba SOP Advance, Infineon Super SO8, NXP LFPAK (SOT669), Renesas WPAK(3F) / LFPAK, Fairchild Power 56, APEC PMPAK 5 × 6, MagnaChip PowerDFN56, ROHM HSOP8, UBIQ PRPAK56, NIKO−SEM PDFN 5 × 6, NEC 8-pin HVSON. Datasheets: https://www.onsemi.com/pub/Collateral/AND9137-D.PDF, https://assets.nexperia.com/documents/leaflet/75016838.pdf
- Pads
- 5
- SMD
- 7.3×5.8
- Boards
- 9
QFN-32-1EP_4x4mm_P0.4mm_EP2.65x2.65mm
Package_DFN_QFN
QFN, 32 Pin (https://www.renesas.com/eu/en/package-image/pdf/outdrawing/l32.4x4a.pdf)
- Pads
- 33
- SMD
- 5.2×5.2
- Boards
- 9