PQFN-8-EP_6x5mm_P1.27mm_Generic

Package_DFN_QFN

Universal Footprint for Thermally-enhanced SO-8 packages; compatible with Vishay PowerPAK SO−8, International Rectifier PQFN, Texas Instrument SON 5 × 6 mm (Q5A), Alpha and Omega DFN 5 × 6, ST Microelectronics PowerFLAT™ 5 × 6, Toshiba SOP Advance, Infineon Super SO8, NXP LFPAK (SOT669), Renesas WPAK(3F) / LFPAK, Fairchild Power 56, APEC PMPAK 5 × 6, MagnaChip PowerDFN56, ROHM HSOP8, UBIQ PRPAK56, NIKO−SEM PDFN 5 × 6, NEC 8-pin HVSON. Datasheets: https://www.onsemi.com/pub/Collateral/AND9137-D.PDF, https://assets.nexperia.com/documents/leaflet/75016838.pdf

Footprint

5 pads
Footprint PQFN-8-EP_6x5mm_P1.27mm_Generic
Mount
Surface mount
Courtyard
7.3 × 5.8 mm
Pads
5
File
7 KB

3D model

STEP

Package_DFN_QFN_PQFN-8-EP_6x5mm_P1.27mm_Generic

6.15 × 5.15 × 1.09 mm

241 KB STEP

Library
Package_DFN_QFN_PQFN-8-EP_6x5mm_P1.27mm
Model page
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On real boards

The largest boards that carry it

Provenance

Credit
KiCad Libraries Contributors
Licence
CC-BY-SA-4.0-with-KiCad-exception