Footprints
5 footprints matching “1.27”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
AO_DFN-8-1EP_5.55x5.2mm_P1.27mm_EP4.12x4.6mm
Package_DFN_QFN
DD Package; 8-Lead Plastic DFN (5.55mm x 5.2mm), Pin 5-8 connected to EP (http://www.aosmd.com/res/packaging_information/DFN5x6_8L_EP1_P.pdf)
- Pads
- 5
- SMD
- 6.7×5.7
- Boards
- 10
PQFN-8-EP_6x5mm_P1.27mm_Generic
Package_DFN_QFN
Universal Footprint for Thermally-enhanced SO-8 packages; compatible with Vishay PowerPAK SO−8, International Rectifier PQFN, Texas Instrument SON 5 × 6 mm (Q5A), Alpha and Omega DFN 5 × 6, ST Microelectronics PowerFLAT™ 5 × 6, Toshiba SOP Advance, Infineon Super SO8, NXP LFPAK (SOT669), Renesas WPAK(3F) / LFPAK, Fairchild Power 56, APEC PMPAK 5 × 6, MagnaChip PowerDFN56, ROHM HSOP8, UBIQ PRPAK56, NIKO−SEM PDFN 5 × 6, NEC 8-pin HVSON. Datasheets: https://www.onsemi.com/pub/Collateral/AND9137-D.PDF, https://assets.nexperia.com/documents/leaflet/75016838.pdf
- Pads
- 5
- SMD
- 7.3×5.8
- Boards
- 9
DFN-S-8-1EP_6x5mm_P1.27mm
Package_DFN_QFN
8-Lead Plastic Dual Flat, No Lead Package (MF) - 6x5 mm Body [DFN-S] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 9
- SMD
- 7.2×5.7
- Boards
- 3
WDFN-8-1EP_6x5mm_P1.27mm_EP3.4x4mm
Package_DFN_QFN
WDFN, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_WDFN_5x6mm_MF_C04210B.pdf)
- Pads
- 9
- SMD
- 7.2×5.5
- Boards
- 2
W-PDFN-8-1EP_6x5mm_P1.27mm_EP3x3mm
Package_DFN_QFN
W-PDFN, 8 Pin (https://www.mouser.com/datasheet/2/671/mt25q_qljs_u_256_aba_0-3178731.pdf#page=22)
- Pads
- 9
- SMD
- 7.3×5.5
- Boards
- 1