Footprints

87 footprints matching “7”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints that come with a 3D model.

87 footprints · page 1 of 4

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QFN-56-1EP_7x7mm_P0.4mm_EP3.2x3.2mm

FP3D

Package_DFN_QFN

QFN, 56 Pin (https://datasheets.raspberrypi.com/rp2040/rp2040-datasheet.pdf#page=607)

Pads: 57
SMD: 8.3×8.3
Boards: 381

QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm

FP3D

Package_DFN_QFN

QFN, 16 Pin (https://www.st.com/resource/en/datasheet/tsv521.pdf)

Pads: 17
SMD: 4.3×4.3
Boards: 44

QFN-24-1EP_4x4mm_P0.5mm_EP2.7x2.7mm

FP3D

Package_DFN_QFN

QFN, 24 Pin (https://www.alldatasheet.com/datasheet-pdf/pdf/1159021/ALFA/AS3330.html)

Pads: 25
SMD: 5.3×5.3
Boards: 41

QFN-36-1EP_6x6mm_P0.5mm_EP3.7x3.7mm

FP3D

Package_DFN_QFN

QFN, 36 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/36L_QFN_6x6_with_3_7x3_7_EP_Punch_Dimpled_4E_C04-0241A.pdf)

Pads: 37
SMD: 7.2×7.2
Boards: 40

QFN-56-1EP_7x7mm_P0.4mm_EP5.6x5.6mm

FP3D

Package_DFN_QFN

QFN, 56 Pin (http://www.cypress.com/file/416486/download#page=40)

Pads: 57
SMD: 8.3×8.3
Boards: 34

QFN-56-1EP_7x7mm_P0.4mm_EP4x4mm

FP3D

Package_DFN_QFN

QFN, 56 Pin (https://www.espressif.com/sites/default/files/documentation/esp32-s2_datasheet_en.pdf#page=41)

Pads: 57
SMD: 8.2×8.2
Boards: 24

QFN-32-1EP_5x5mm_P0.5mm_EP3.7x3.7mm

FP3D

Package_DFN_QFN

QFN, 32 Pin (https://www.espressif.com/sites/default/files/documentation/0a-esp8285_datasheet_en.pdf)

Pads: 33
SMD: 6.2×6.2
Boards: 23

QFN-56-1EP_7x7mm_P0.4mm_EP3.2x3.2mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 56 Pin (https://datasheets.raspberrypi.com/rp2040/rp2040-datasheet.pdf#page=607)

Pads: 57
SMD: 8.3×8.3
Boards: 21

DFN-8-1EP_2x2mm_P0.5mm_EP1.05x1.75mm

FP3D

Package_DFN_QFN

DFN8 2x2, 0.5P; CASE 506CN (see ON Semiconductor 506CN.PDF)

Pads: 9
SMD: 2.8×2.5
Boards: 20

QFN-24-1EP_4x4mm_P0.5mm_EP2.7x2.7mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 24 Pin (https://www.alldatasheet.com/datasheet-pdf/pdf/1159021/ALFA/AS3330.html)

Pads: 25
SMD: 5.3×5.3
Boards: 20

QFN-48-1EP_7x7mm_P0.5mm_EP5.15x5.15mm

FP3D

Package_DFN_QFN

QFN, 48 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_48_05-08-1704.pdf)

Pads: 49
SMD: 8.3×8.3
Boards: 19

DFN-8-1EP_3x2mm_P0.5mm_EP1.75x1.45mm

FP3D

Package_DFN_QFN

8-Lead Plastic Dual Flat, No Lead Package (MC) - 2x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 9
SMD: 4.2×2.6
Boards: 18

Nordic_AQFN-73-1EP_7x7mm_P0.5mm

FP3D

Package_DFN_QFN

http://infocenter.nordicsemi.com/index.jsp?topic=%2Fcom.nordic.infocenter.nrf52%2Fdita%2Fnrf52%2Fchips%2Fnrf52840.html

Pads: 74
SMD: 9.0×9.0
Boards: 18

DFN-14-1EP_3x3mm_P0.4mm_EP1.78x2.35mm

FP3D

Package_DFN_QFN

DD Package; 14-Lead Plastic DFN (3mm x 3mm) (http://pdfserv.maximintegrated.com/land_patterns/90-0063.PDF)

Pads: 15
SMD: 4.0×3.6
Boards: 14

QFN-24-1EP_3x3mm_P0.4mm_EP1.75x1.6mm

FP3D

Package_DFN_QFN

QFN, 24 Pin (https://www.invensense.com/wp-content/uploads/2015/02/PS-MPU-9250A-01-v1.1.pdf#page=39)

Pads: 25
SMD: 4.3×4.3
Boards: 13

QFN-44-1EP_7x7mm_P0.5mm_EP5.15x5.15mm

FP3D

Package_DFN_QFN

QFN, 44 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_44_05-08-1763.pdf)

Pads: 45
SMD: 8.3×8.3
Boards: 13

AO_DFN-8-1EP_5.55x5.2mm_P1.27mm_EP4.12x4.6mm

FP3D

Package_DFN_QFN

DD Package; 8-Lead Plastic DFN (5.55mm x 5.2mm), Pin 5-8 connected to EP (http://www.aosmd.com/res/packaging_information/DFN5x6_8L_EP1_P.pdf)

Pads: 5
SMD: 6.7×5.7
Boards: 10

DFN-6-1EP_3x3mm_P0.95mm_EP1.7x2.6mm

FP3D

Package_DFN_QFN

DFN6 3*3 MM, 0.95 PITCH; CASE 506AH-01 (see ON Semiconductor 506AH.PDF)

Pads: 7
SMD: 3.8×3.7
Boards: 10

PQFN-8-EP_6x5mm_P1.27mm_Generic

FP3D

Package_DFN_QFN

Universal Footprint for Thermally-enhanced SO-8 packages; compatible with Vishay PowerPAK SO−8, International Rectifier PQFN, Texas Instrument SON 5 × 6 mm (Q5A), Alpha and Omega DFN 5 × 6, ST Microelectronics PowerFLAT™ 5 × 6, Toshiba SOP Advance, Infineon Super SO8, NXP LFPAK (SOT669), Renesas WPAK(3F) / LFPAK, Fairchild Power 56, APEC PMPAK 5 × 6, MagnaChip PowerDFN56, ROHM HSOP8, UBIQ PRPAK56, NIKO−SEM PDFN 5 × 6, NEC 8-pin HVSON. Datasheets: https://www.onsemi.com/pub/Collateral/AND9137-D.PDF, https://assets.nexperia.com/documents/leaflet/75016838.pdf

Pads: 5
SMD: 7.3×5.8
Boards: 9