Footprints

106 footprints matching “8”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Footprints that come with a 3D model.

106 footprints · page 1 of 5

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QFN-28-1EP_5x5mm_P0.5mm_EP3.35x3.35mm

FP3D

Package_DFN_QFN

QFN, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=283)

Pads: 29
SMD: 6.2×6.2
Boards: 175

DFN-8-1EP_3x3mm_P0.65mm_EP1.55x2.4mm

FP3D

Package_DFN_QFN

8-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 9
SMD: 4.3×3.5
Boards: 55

DFN-8-1EP_3x2mm_P0.5mm_EP1.3x1.5mm

FP3D

Package_DFN_QFN

DFN, 8 Pin (https://ww1.microchip.com/downloads/en/DeviceDoc/AT24C64D-I%C2%B2C-Compatible-(2-Wire)-Serial-EEPROM-64-Kbit-(8,192x8)-20005937C.pdf)

Pads: 9
SMD: 4.3×2.5
Boards: 47

QFN-28-1EP_6x6mm_P0.65mm_EP4.25x4.25mm

FP3D

Package_DFN_QFN

QFN, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=289)

Pads: 29
SMD: 7.2×7.2
Boards: 30

DFN-8-1EP_3x3mm_P0.5mm_EP1.66x2.38mm

FP3D

Package_DFN_QFN

DD Package; 8-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_8_05-08-1698.pdf)

Pads: 9
SMD: 4.0×3.6
Boards: 23

DFN-8-1EP_2x2mm_P0.5mm_EP1.05x1.75mm

FP3D

Package_DFN_QFN

DFN8 2x2, 0.5P; CASE 506CN (see ON Semiconductor 506CN.PDF)

Pads: 9
SMD: 2.8×2.5
Boards: 20

QFN-48-1EP_7x7mm_P0.5mm_EP5.15x5.15mm

FP3D

Package_DFN_QFN

QFN, 48 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_48_05-08-1704.pdf)

Pads: 49
SMD: 8.3×8.3
Boards: 19

DFN-8-1EP_3x2mm_P0.5mm_EP1.75x1.45mm

FP3D

Package_DFN_QFN

8-Lead Plastic Dual Flat, No Lead Package (MC) - 2x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 9
SMD: 4.2×2.6
Boards: 18

DFN-10-1EP_3x3mm_P0.5mm_EP1.65x2.38mm

FP3D

Package_DFN_QFN

DFN, 10 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/lt3471.pdf#page=15)

Pads: 11
SMD: 4.3×3.5
Boards: 17

UQFN-10_1.4x1.8mm_P0.4mm

FP3D

Package_DFN_QFN

UQFN, 10 Pin (https://www.onsemi.com/pub/Collateral/488AT.PDF)

Pads: 10
SMD: 2.6×3.0
Boards: 15

DFN-14-1EP_3x3mm_P0.4mm_EP1.78x2.35mm

FP3D

Package_DFN_QFN

DD Package; 14-Lead Plastic DFN (3mm x 3mm) (http://pdfserv.maximintegrated.com/land_patterns/90-0063.PDF)

Pads: 15
SMD: 4.0×3.6
Boards: 14

QFN-28-1EP_5x5mm_P0.5mm_EP3.35x3.35mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=283)

Pads: 29
SMD: 6.2×6.2
Boards: 14

QFN-28-1EP_6x6mm_P0.65mm_EP4.8x4.8mm

FP3D

Package_DFN_QFN

QFN, 28 Pin (https://semtech.my.salesforce.com/sfc/p/#E0000000JelG/a/440000001NCE/v_VBhk1IolDgxwwnOpcS_vTFxPfSEPQbuneK3mWsXlU page=125)

Pads: 29
SMD: 7.3×7.3
Boards: 14

DFN-8-1EP_2x3mm_P0.5mm_EP0.61x2.2mm

FP3D

Package_DFN_QFN

DFN, 8 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-dfn/05081702_c_ddb8.pdf)

Pads: 9
SMD: 3.3×3.5
Boards: 13

UDFN-4-1EP_1x1mm_P0.65mm_EP0.48x0.48mm

FP3D

Package_DFN_QFN

UDFN-4_1x1mm_P0.65mm, http://ww1.microchip.com/downloads/en/DeviceDoc/MIC550x-300mA-Single-Output-LDO-in-Small-Packages-DS20006006A.pdf

Pads: 5
SMD: 1.8×1.5
Boards: 12

DFN-10-1EP_3x3mm_P0.5mm_EP1.55x2.48mm

FP3D

Package_DFN_QFN

10-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 11
SMD: 4.3×3.7
Boards: 11

AO_DFN-8-1EP_5.55x5.2mm_P1.27mm_EP4.12x4.6mm

FP3D

Package_DFN_QFN

DD Package; 8-Lead Plastic DFN (5.55mm x 5.2mm), Pin 5-8 connected to EP (http://www.aosmd.com/res/packaging_information/DFN5x6_8L_EP1_P.pdf)

Pads: 5
SMD: 6.7×5.7
Boards: 10

DFN-8_2x2mm_P0.5mm

FP3D

Package_DFN_QFN

DFN8 2x2, 0.5P; No exposed pad - Ref http://pdfserv.maximintegrated.com/land_patterns/90-0349.PDF

Pads: 8
SMD: 3.3×2.7
Boards: 9

PQFN-8-EP_6x5mm_P1.27mm_Generic

FP3D

Package_DFN_QFN

Universal Footprint for Thermally-enhanced SO-8 packages; compatible with Vishay PowerPAK SO−8, International Rectifier PQFN, Texas Instrument SON 5 × 6 mm (Q5A), Alpha and Omega DFN 5 × 6, ST Microelectronics PowerFLAT™ 5 × 6, Toshiba SOP Advance, Infineon Super SO8, NXP LFPAK (SOT669), Renesas WPAK(3F) / LFPAK, Fairchild Power 56, APEC PMPAK 5 × 6, MagnaChip PowerDFN56, ROHM HSOP8, UBIQ PRPAK56, NIKO−SEM PDFN 5 × 6, NEC 8-pin HVSON. Datasheets: https://www.onsemi.com/pub/Collateral/AND9137-D.PDF, https://assets.nexperia.com/documents/leaflet/75016838.pdf

Pads: 5
SMD: 7.3×5.8
Boards: 9