Footprints
56 footprints matching “P1”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
DFN-8-1EP_3x3mm_P0.65mm_EP1.55x2.4mm
Package_DFN_QFN
8-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 9
- SMD
- 4.3×3.5
- Boards
- 55
DFN-8-1EP_3x2mm_P0.5mm_EP1.3x1.5mm
Package_DFN_QFN
DFN, 8 Pin (https://ww1.microchip.com/downloads/en/DeviceDoc/AT24C64D-I%C2%B2C-Compatible-(2-Wire)-Serial-EEPROM-64-Kbit-(8,192x8)-20005937C.pdf)
- Pads
- 9
- SMD
- 4.3×2.5
- Boards
- 47
QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm
Package_DFN_QFN
QFN, 16 Pin (https://www.st.com/resource/en/datasheet/tsv521.pdf)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- 44
DFN-6-1EP_2x2mm_P0.65mm_EP1x1.6mm
Package_DFN_QFN
6-Lead Plastic Dual Flat, No Lead Package (MA) - 2x2x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 7
- SMD
- 3.3×2.5
- Boards
- 32
DFN-8-1EP_3x3mm_P0.5mm_EP1.66x2.38mm
Package_DFN_QFN
DD Package; 8-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_8_05-08-1698.pdf)
- Pads
- 9
- SMD
- 4.0×3.6
- Boards
- 23
DFN-8-1EP_2x2mm_P0.5mm_EP1.05x1.75mm
Package_DFN_QFN
DFN8 2x2, 0.5P; CASE 506CN (see ON Semiconductor 506CN.PDF)
- Pads
- 9
- SMD
- 2.8×2.5
- Boards
- 20
DFN-8-1EP_3x2mm_P0.5mm_EP1.75x1.45mm
Package_DFN_QFN
8-Lead Plastic Dual Flat, No Lead Package (MC) - 2x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 9
- SMD
- 4.2×2.6
- Boards
- 18
DFN-10-1EP_3x3mm_P0.5mm_EP1.65x2.38mm
Package_DFN_QFN
DFN, 10 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/lt3471.pdf#page=15)
- Pads
- 11
- SMD
- 4.3×3.5
- Boards
- 17
DFN-14-1EP_3x3mm_P0.4mm_EP1.78x2.35mm
Package_DFN_QFN
DD Package; 14-Lead Plastic DFN (3mm x 3mm) (http://pdfserv.maximintegrated.com/land_patterns/90-0063.PDF)
- Pads
- 15
- SMD
- 4.0×3.6
- Boards
- 14
QFN-24-1EP_3x3mm_P0.4mm_EP1.75x1.6mm
Package_DFN_QFN
QFN, 24 Pin (https://www.invensense.com/wp-content/uploads/2015/02/PS-MPU-9250A-01-v1.1.pdf#page=39)
- Pads
- 25
- SMD
- 4.3×4.3
- Boards
- 13
DFN-10-1EP_3x3mm_P0.5mm_EP1.55x2.48mm
Package_DFN_QFN
10-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 11
- SMD
- 4.3×3.7
- Boards
- 11
AO_DFN-8-1EP_5.55x5.2mm_P1.27mm_EP4.12x4.6mm
Package_DFN_QFN
DD Package; 8-Lead Plastic DFN (5.55mm x 5.2mm), Pin 5-8 connected to EP (http://www.aosmd.com/res/packaging_information/DFN5x6_8L_EP1_P.pdf)
- Pads
- 5
- SMD
- 6.7×5.7
- Boards
- 10
DFN-6-1EP_3x3mm_P0.95mm_EP1.7x2.6mm
Package_DFN_QFN
DFN6 3*3 MM, 0.95 PITCH; CASE 506AH-01 (see ON Semiconductor 506AH.PDF)
- Pads
- 7
- SMD
- 3.8×3.7
- Boards
- 10
PQFN-8-EP_6x5mm_P1.27mm_Generic
Package_DFN_QFN
Universal Footprint for Thermally-enhanced SO-8 packages; compatible with Vishay PowerPAK SO−8, International Rectifier PQFN, Texas Instrument SON 5 × 6 mm (Q5A), Alpha and Omega DFN 5 × 6, ST Microelectronics PowerFLAT™ 5 × 6, Toshiba SOP Advance, Infineon Super SO8, NXP LFPAK (SOT669), Renesas WPAK(3F) / LFPAK, Fairchild Power 56, APEC PMPAK 5 × 6, MagnaChip PowerDFN56, ROHM HSOP8, UBIQ PRPAK56, NIKO−SEM PDFN 5 × 6, NEC 8-pin HVSON. Datasheets: https://www.onsemi.com/pub/Collateral/AND9137-D.PDF, https://assets.nexperia.com/documents/leaflet/75016838.pdf
- Pads
- 5
- SMD
- 7.3×5.8
- Boards
- 9
DFN-10-1EP_3x3mm_P0.5mm_EP1.65x2.38mm_ThermalVias
Package_DFN_QFN
DFN, 10 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/lt3471.pdf#page=15)
- Pads
- 11
- SMD
- 4.3×3.5
- Boards
- 8
WQFN-20-1EP_2.5x4.5mm_P0.5mm_EP1x2.9mm
Package_DFN_QFN
http://www.onsemi.com/pub/Collateral/510CD.PDF
- Pads
- 21
- SMD
- 4.0×6.0
- Boards
- 8
WQFN-16-1EP_3x3mm_P0.5mm_EP1.6x1.6mm_ThermalVias
Package_DFN_QFN
WQFN, 16 Pin (https://www.ti.com/lit/ds/symlink/tpa6132a2.pdf#page=24)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- 7
QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm_ThermalVias
Package_DFN_QFN
QFN, 16 Pin (https://www.st.com/resource/en/datasheet/tsv521.pdf)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- 6
TQFN-16-1EP_3x3mm_P0.5mm_EP1.6x1.6mm
Package_DFN_QFN
TQFN, 16 Pin (https://www.diodes.com/assets/Datasheets/PI6C5946002.pdf#page=12)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- 6
DFN-12-1EP_3x4mm_P0.5mm_EP1.7x3.3mm
Package_DFN_QFN
DE/UE Package; 12-Lead Plastic DFN (4mm x 3mm) (see Linear Technology DFN_12_05-08-1695.pdf)
- Pads
- 13
- SMD
- 4.1×4.6
- Boards
- 5
UQFN-20-1EP_3x3mm_P0.4mm_EP1.85x1.85mm
Package_DFN_QFN
UQFN, 20 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=332)
- Pads
- 21
- SMD
- 4.2×4.2
- Boards
- 5
DFN-16-1EP_3x4mm_P0.45mm_EP1.7x3.3mm
Package_DFN_QFN
DE Package; 16-Lead Plastic DFN (4mm x 3mm) (see Linear Technology DFN_16_05-08-1732.pdf)
- Pads
- 17
- SMD
- 4.1×4.6
- Boards
- 4
QFN-20-1EP_3x4mm_P0.5mm_EP1.65x2.65mm_ThermalVias
Package_DFN_QFN
QFN, 20 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_20_05-08-1742.pdf)
- Pads
- 21
- SMD
- 4.3×5.3
- Boards
- 4
DFN-S-8-1EP_6x5mm_P1.27mm
Package_DFN_QFN
8-Lead Plastic Dual Flat, No Lead Package (MF) - 6x5 mm Body [DFN-S] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 9
- SMD
- 7.2×5.7
- Boards
- 3