Footprints

8 footprints matching “SO”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints that come with a 3D model.

8 footprints

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PQFN-8-EP_6x5mm_P1.27mm_Generic

FP3D

Package_DFN_QFN

Universal Footprint for Thermally-enhanced SO-8 packages; compatible with Vishay PowerPAK SO−8, International Rectifier PQFN, Texas Instrument SON 5 × 6 mm (Q5A), Alpha and Omega DFN 5 × 6, ST Microelectronics PowerFLAT™ 5 × 6, Toshiba SOP Advance, Infineon Super SO8, NXP LFPAK (SOT669), Renesas WPAK(3F) / LFPAK, Fairchild Power 56, APEC PMPAK 5 × 6, MagnaChip PowerDFN56, ROHM HSOP8, UBIQ PRPAK56, NIKO−SEM PDFN 5 × 6, NEC 8-pin HVSON. Datasheets: https://www.onsemi.com/pub/Collateral/AND9137-D.PDF, https://assets.nexperia.com/documents/leaflet/75016838.pdf

Pads: 5
SMD: 7.3×5.8
Boards: 9

HVQFN-36-1EP_6x6mm_P0.5mm_EP3.9x3.9mm

FP3D

Package_DFN_QFN

HVQFN, 36 Pin (https://www.nxp.com.cn/docs/en/package-information/SOT1092-2.pdf)

Pads: 37
SMD: 7.3×7.3
Boards: —

HVQFN-36-1EP_6x6mm_P0.5mm_EP3.9x3.9mm_ThermalVias

FP3D

Package_DFN_QFN

HVQFN, 36 Pin (https://www.nxp.com.cn/docs/en/package-information/SOT1092-2.pdf)

Pads: 37
SMD: 7.3×7.3
Boards: —

Maxim_WSON-8-1EP_3x2mm_P0.5mm_EP1.75x1.63mm

FP3D

Package_DFN_QFN

Maxim WSON, 8 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tdfn-ep/21-0174.pdf, https://www.analog.com/media/en/package-pcb-resources/land-pattern/tdfn-ep/90-0091.pdf)

Pads: 9
SMD: 4.1×2.5
Boards: —