Footprints

389 footprints matching “R”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

389 footprints · page 1 of 17

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Renesas_UQFN-16_2x2mm_P0.4mm

FP—

Package_DFN_QFN

Renesas UQFN, 16 Pin (Renesas STQFN-16L, https://www.renesas.com/en/document/dst/slg47011-datasheet#page=228)

Pads: 16
SMD: 2.8×2.8
Boards: —

Renesas_UQFN-20_2x3mm_P0.4mm_LayoutBorder4x6y

FP—

Package_DFN_QFN

Renesas UQFN, 20 Pin (Renesas STQFN-20L, https://www.renesas.com/en/document/dst/slg465808283-datasheet#page=200)

Pads: 20
SMD: 3.2×4.2
Boards: —

ROHM_DFN0604-3

FP—

Package_DFN_QFN

DFN package size 0604 3 pins

Pads: 3
SMD: 1.1×1.1
Boards: —

VQFN-16-1EP_3x3mm_P0.5mm_EP1.68x1.68mm_ThermalVias

FP—

Package_DFN_QFN

VQFN, 16 Pin (http://www.ti.com/lit/ds/symlink/tlv62095.pdf)

Pads: 17
SMD: 4.3×4.3
Boards: 33

QFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 24 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=278)

Pads: 25
SMD: 5.2×5.2
Boards: 24

VQFN-24-1EP_4x4mm_P0.5mm_EP2.5x2.5mm_ThermalVias

FP—

Package_DFN_QFN

VQFN, 24 Pin (https://ww1.microchip.com/downloads/aemDocuments/documents/product-documents/package-drawings/24L-VQFN%E2%80%934x4x0.9mm-MJ-C04-00143b.pdf)

Pads: 25
SMD: 5.3×5.3
Boards: 22

QFN-56-1EP_7x7mm_P0.4mm_EP3.2x3.2mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 56 Pin (https://datasheets.raspberrypi.com/rp2040/rp2040-datasheet.pdf#page=607)

Pads: 57
SMD: 8.3×8.3
Boards: 21

QFN-24-1EP_4x4mm_P0.5mm_EP2.7x2.7mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 24 Pin (https://www.alldatasheet.com/datasheet-pdf/pdf/1159021/ALFA/AS3330.html)

Pads: 25
SMD: 5.3×5.3
Boards: 20

Nordic_AQFN-73-1EP_7x7mm_P0.5mm

FP3D

Package_DFN_QFN

http://infocenter.nordicsemi.com/index.jsp?topic=%2Fcom.nordic.infocenter.nrf52%2Fdita%2Fnrf52%2Fchips%2Fnrf52840.html

Pads: 74
SMD: 9.0×9.0
Boards: 18

VQFN-24-1EP_4x4mm_P0.5mm_EP2.45x2.45mm_ThermalVias

FP—

Package_DFN_QFN

VQFN, 24 Pin (http://www.ti.com/lit/ds/symlink/msp430f1101a.pdf)

Pads: 25
SMD: 5.3×5.3
Boards: 16

QFN-20-1EP_4x4mm_P0.5mm_EP2.6x2.6mm_ThermalVias

FP—

Package_DFN_QFN

QFN, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/doc2535.pdf#page=164)

Pads: 21
SMD: 5.2×5.2
Boards: 15

QFN-40-1EP_5x5mm_P0.4mm_EP3.6x3.6mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 40 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=297)

Pads: 41
SMD: 6.2×6.2
Boards: 15

QFN-28-1EP_5x5mm_P0.5mm_EP3.35x3.35mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=283)

Pads: 29
SMD: 6.2×6.2
Boards: 14

QFN-32-1EP_5x5mm_P0.5mm_EP3.6x3.6mm_ThermalVias

FP—

Package_DFN_QFN

QFN, 32 Pin (http://infocenter.nordicsemi.com/pdf/nRF52810_PS_v1.1.pdf#page=468)

Pads: 33
SMD: 6.2×6.2
Boards: 14

DFN-8-1EP_2x3mm_P0.5mm_EP0.61x2.2mm

FP3D

Package_DFN_QFN

DFN, 8 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-dfn/05081702_c_ddb8.pdf)

Pads: 9
SMD: 3.3×3.5
Boards: 13

QFN-20-1EP_3x3mm_P0.4mm_EP1.65x1.65mm_ThermalVias

FP—

Package_DFN_QFN

QFN, 20 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/3553fc.pdf#page=34)

Pads: 21
SMD: 4.3×4.3
Boards: 12

QFN-20-1EP_4x4mm_P0.5mm_EP2.5x2.5mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 20 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=274)

Pads: 21
SMD: 5.2×5.2
Boards: 12

HVQFN-40-1EP_6x6mm_P0.5mm_EP4.1x4.1mm_ThermalVias

FP—

Package_DFN_QFN

HVQFN, 40 Pin (https://www.nxp.com/docs/en/package-information/SOT618-1.pdf)

Pads: 41
SMD: 7.3×7.3
Boards: 9

Linear_DE14MA

FP—

Package_DFN_QFN

14-Lead Plastic DFN, 4mm x 3mm (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-dfn/05081731_C_DE14MA.pdf)

Pads: 14
SMD: 4.0×4.5
Boards: 9

PQFN-8-EP_6x5mm_P1.27mm_Generic

FP3D

Package_DFN_QFN

Universal Footprint for Thermally-enhanced SO-8 packages; compatible with Vishay PowerPAK SO−8, International Rectifier PQFN, Texas Instrument SON 5 × 6 mm (Q5A), Alpha and Omega DFN 5 × 6, ST Microelectronics PowerFLAT™ 5 × 6, Toshiba SOP Advance, Infineon Super SO8, NXP LFPAK (SOT669), Renesas WPAK(3F) / LFPAK, Fairchild Power 56, APEC PMPAK 5 × 6, MagnaChip PowerDFN56, ROHM HSOP8, UBIQ PRPAK56, NIKO−SEM PDFN 5 × 6, NEC 8-pin HVSON. Datasheets: https://www.onsemi.com/pub/Collateral/AND9137-D.PDF, https://assets.nexperia.com/documents/leaflet/75016838.pdf

Pads: 5
SMD: 7.3×5.8
Boards: 9