Footprints

27 footprints matching “flat”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

27 footprints · page 1 of 2

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DFN-8-1EP_3x3mm_P0.65mm_EP1.55x2.4mm

FP3D

Package_DFN_QFN

8-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 9
SMD: 4.3×3.5
Boards: 55

DFN-6-1EP_2x2mm_P0.65mm_EP1x1.6mm

FP3D

Package_DFN_QFN

6-Lead Plastic Dual Flat, No Lead Package (MA) - 2x2x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 7
SMD: 3.3×2.5
Boards: 32

DFN-8-1EP_3x2mm_P0.5mm_EP1.75x1.45mm

FP3D

Package_DFN_QFN

8-Lead Plastic Dual Flat, No Lead Package (MC) - 2x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 9
SMD: 4.2×2.6
Boards: 18

SiliconLabs_QFN-20-1EP_3x3mm_P0.5mm_EP1.8x1.8mm

FP—

Package_DFN_QFN

20-Lead Plastic Quad Flat, No Lead Package - 3x3 mm Body [QFN] with corner pads; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf

Pads: 21
SMD: 4.5×4.5
Boards: 18

DFN-8-1EP_3x2mm_P0.5mm_EP1.36x1.46mm

FP—

Package_DFN_QFN

8-Lead Plastic Dual Flat, No Lead Package (8MA2) - 2x3x0.6 mm Body (http://ww1.microchip.com/downloads/en/DeviceDoc/20005010F.pdf)

Pads: 9
SMD: 4.3×2.5
Boards: 15

DFN-10-1EP_3x3mm_P0.5mm_EP1.55x2.48mm

FP3D

Package_DFN_QFN

10-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 11
SMD: 4.3×3.7
Boards: 11

PQFN-8-EP_6x5mm_P1.27mm_Generic

FP3D

Package_DFN_QFN

Universal Footprint for Thermally-enhanced SO-8 packages; compatible with Vishay PowerPAK SO−8, International Rectifier PQFN, Texas Instrument SON 5 × 6 mm (Q5A), Alpha and Omega DFN 5 × 6, ST Microelectronics PowerFLAT™ 5 × 6, Toshiba SOP Advance, Infineon Super SO8, NXP LFPAK (SOT669), Renesas WPAK(3F) / LFPAK, Fairchild Power 56, APEC PMPAK 5 × 6, MagnaChip PowerDFN56, ROHM HSOP8, UBIQ PRPAK56, NIKO−SEM PDFN 5 × 6, NEC 8-pin HVSON. Datasheets: https://www.onsemi.com/pub/Collateral/AND9137-D.PDF, https://assets.nexperia.com/documents/leaflet/75016838.pdf

Pads: 5
SMD: 7.3×5.8
Boards: 9

ST_UFQFPN-20_3x3mm_P0.5mm

FP—

Package_DFN_QFN

UFQFPN 20-lead, 3 x 3 mm, 0.5 mm pitch, ultra thin fine pitch quad flat package (http://www.st.com/resource/en/datasheet/stm8s003f3.pdf)

Pads: 20
SMD: 3.5×3.5
Boards: 6

TDFN-8-1EP_3x2mm_P0.5mm_EP1.80x1.65mm

FP—

Package_DFN_QFN

8-lead plastic dual flat, 2x3x0.75mm size, 0.5mm pitch (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_TDFN_2x3_MN_C04-0129E-MN.pdf)

Pads: 9
SMD: 4.3×2.5
Boards: 5

DFN-12-1EP_3x3mm_P0.5mm_EP2.05x2.86mm

FP—

Package_DFN_QFN

10-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 13
SMD: 4.3×3.6
Boards: 3

DFN-S-8-1EP_6x5mm_P1.27mm

FP3D

Package_DFN_QFN

8-Lead Plastic Dual Flat, No Lead Package (MF) - 6x5 mm Body [DFN-S] (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 9
SMD: 7.2×5.7
Boards: 3

DFN-14-1EP_3x4.5mm_P0.65mm_EP1.65x4.25mm

FP—

Package_DFN_QFN

14-lead very thin plastic quad flat, 3.0x4.5mm size, 0.65mm pitch (http://ww1.microchip.com/downloads/en/DeviceDoc/14L_VDFN_4_5x3_0mm_JHA_C041198A.pdf)

Pads: 15
SMD: 4.4×5.0
Boards: 2

Microsemi_QFN-40-32-2EP_6x8mm_P0.5mm

FP—

Package_DFN_QFN

40-Lead (32-Lead Populated) Plastic Quad Flat, No Lead Package - 6x8x0.9mm Body (https://www.microsemi.com/document-portal/doc_download/131677-pd70224-data-sheet)

Pads: 34
SMD: 6.9×8.9
Boards: 2

QFN-64-1EP_9x9mm_P0.5mm_EP7.35x7.35mm

FP3D

Package_DFN_QFN

64-Lead Plastic Quad Flat, No Lead Package (MR) - 9x9x0.9 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 65
SMD: 10.3×10.3
Boards: 2

UQFN-16-1EP_3x3mm_P0.5mm_EP1.75x1.75mm

FP3D

Package_DFN_QFN

16-Lead Ultra Thin Quad Flat, No Lead Package (UC) - 3x3x0.5 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 17
SMD: 4.3×4.3
Boards: 2

DFN-10-1EP_3x3mm_P0.5mm_EP1.75x2.7mm

FP—

Package_DFN_QFN

10-Lead Plastic Dual Flat No-Lead Package, 3x3mm Body (see Atmel Appnote 8826)

Pads: 11
SMD: 4.3×3.5
Boards: 1

DFN-8-1EP_4x4mm_P0.8mm_EP2.39x2.21mm

FP—

Package_DFN_QFN

8-Lead Plastic Dual Flat, No Lead Package (MD) - 4x4x0.9 mm Body [DFN] (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF)

Pads: 9
SMD: 4.8×4.7
Boards: 1

DFN-8-1EP_4x4mm_P0.8mm_EP2.5x3.6mm

FP3D

Package_DFN_QFN

8-Lead Plastic Dual Flat, No Lead Package (MD) - 4x4x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 9
SMD: 5.3×4.7
Boards: 1

SiliconLabs_QFN-20-1EP_3x3mm_P0.5mm_EP1.8x1.8mm_ThermalVias

FP—

Package_DFN_QFN

20-Lead Plastic Quad Flat, No Lead Package - 3x3 mm Body [QFN] with corner pads and thermal vias; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf

Pads: 21
SMD: 4.5×4.5
Boards: 1

DFN-14-1EP_3x4.5mm_P0.65mm_EP1.65x4.25mm_ThermalVias

FP—

Package_DFN_QFN

14-lead very thin plastic quad flat, 3.0x4.5mm size, 0.65mm pitch (http://ww1.microchip.com/downloads/en/DeviceDoc/14L_VDFN_4_5x3_0mm_JHA_C041198A.pdf)

Pads: 15
SMD: 4.4×5.0
Boards: —

Microchip_8E-16

FP—

Package_DFN_QFN

16-Lead Quad Flat, No Lead Package (8E) - 4x4x0.9 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 17
SMD: 5.0×5.0
Boards: —

OnSemi_UDFN-8_1.2x1.8mm_P0.4mm

FP—

Package_DFN_QFN

8-Lead Plastic Dual Flat, No Lead Package, 1.2x1.8x1.55 mm Body [UDFN] (See http://www.onsemi.com/pub/Collateral/NLSV2T244-D.PDF)

Pads: 8
SMD: 2.0×2.3
Boards: —

QFN-44-1EP_9x9mm_P0.65mm_EP7.5x7.5mm

FP—

Package_DFN_QFN

44-Lead Plastic Quad Flat, No Lead Package - 9x9 mm Body [QFN]; see section 10.3 of https://www.parallax.com/sites/default/files/downloads/P8X32A-Propeller-Datasheet-v1.4.0_0.pdf

Pads: 45
SMD: 9.7×9.7
Boards: —

QFN-44-1EP_9x9mm_P0.65mm_EP7.5x7.5mm_ThermalVias

FP—

Package_DFN_QFN

44-Lead Plastic Quad Flat, No Lead Package - 9x9 mm Body [QFN] with thermal vias; see section 10.3 of https://www.parallax.com/sites/default/files/downloads/P8X32A-Propeller-Datasheet-v1.4.0_0.pdf

Pads: 45
SMD: 9.7×9.7
Boards: —