Footprints

13 footprints matching “12”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints that come with a 3D model.

13 footprints

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DIP-12_W7.62mm

FP3D

Package_DIP

12-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)

Pads: 12
THT: 9.7×15.7
Boards: 4

DIP-12_W10.16mm

FP3D

Package_DIP

12-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils)

Pads: 12
THT: 12.3×15.7
Boards: 3

DIP-12_W7.62mm_LongPads

FP3D

Package_DIP

12-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads

Pads: 12
THT: 10.5×15.7
Boards: 3

DIP-12_W10.16mm_LongPads

FP3D

Package_DIP

12-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads

Pads: 12
THT: 13.1×15.7
Boards: 1

DIP-12_W7.62mm_SMDSocket_SmallPads

FP3D

Package_DIP

12-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads

Pads: 12
SMD: 10.7×15.9
Boards: 1

DIP-12_W7.62mm_Socket

FP3D

Package_DIP

12-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket

Pads: 12
THT: 10.7×15.9
Boards: 1

DIP-12_W7.62mm_Socket_LongPads

FP3D

Package_DIP

12-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads

Pads: 12
THT: 10.7×15.9
Boards: 1

DIP-12_W8.89mm_SMDSocket_LongPads

FP3D

Package_DIP

12-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads

Pads: 12
SMD: 12.5×15.9
Boards: 1

PowerIntegrations_eDIP-12B

FP3D

Package_DIP

Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf

Pads: 11
THT: 12.1×10.8
Boards: —

SMDIP-12_W11.48mm

FP3D

Package_DIP

12-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)

Pads: 12
SMD: 14.0×15.7
Boards: —

SMDIP-12_W7.62mm

FP3D

Package_DIP

12-lead surface-mounted (SMD) DIP package, row spacing 7.62mm (300 mils)

Pads: 12
SMD: 10.1×15.7
Boards: —

SMDIP-12_W9.53mm

FP3D

Package_DIP

12-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils)

Pads: 12
SMD: 12.0×15.7
Boards: —

SMDIP-12_W9.53mm_Clearance8mm

FP3D

Package_DIP

12-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils), Clearance8mm

Pads: 12
SMD: 11.5×15.7
Boards: —