Footprints

281 footprints

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

281 footprints · page 10 of 12

DIP-64_W15.24mm_SMDSocket_SmallPads

FP3D

Package_DIP

64-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), SMDSocket, SmallPads

Pads: 64
SMD: 18.3×81.9
Boards: —

DIP-64_W15.24mm_Socket

FP3D

Package_DIP

64-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), Socket

Pads: 64
THT: 18.3×81.9
Boards: —

DIP-64_W15.24mm_Socket_LongPads

FP3D

Package_DIP

64-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), Socket, LongPads

Pads: 64
THT: 18.3×81.9
Boards: —

DIP-64_W16.51mm_SMDSocket_LongPads

FP3D

Package_DIP

64-lead though-hole mounted DIP package, row spacing 16.51mm (650 mils), SMDSocket, LongPads

Pads: 64
SMD: 20.1×81.9
Boards: —

DIP-64_W22.86mm_SMDSocket_SmallPads

FP3D

Package_DIP

64-lead though-hole mounted DIP package, row spacing 22.86mm (900 mils), SMDSocket, SmallPads

Pads: 64
SMD: 25.9×81.9
Boards: —

DIP-64_W24.13mm_SMDSocket_LongPads

FP3D

Package_DIP

64-lead though-hole mounted DIP package, row spacing 24.13mm (950 mils), SMDSocket, LongPads

Pads: 64
SMD: 27.7×81.9
Boards: —

DIP-64_W25.4mm_LongPads

FP3D

Package_DIP

64-lead though-hole mounted DIP package, row spacing 25.4mm (1000 mils), LongPads

Pads: 64
THT: 28.3×81.8
Boards: —

DIP-64_W25.4mm_SMDSocket_SmallPads

FP3D

Package_DIP

64-lead though-hole mounted DIP package, row spacing 25.4mm (1000 mils), SMDSocket, SmallPads

Pads: 64
SMD: 28.4×81.9
Boards: —

DIP-64_W25.4mm_Socket

FP3D

Package_DIP

64-lead though-hole mounted DIP package, row spacing 25.4mm (1000 mils), Socket

Pads: 64
THT: 28.4×81.9
Boards: —

DIP-64_W26.67mm_SMDSocket_LongPads

FP3D

Package_DIP

64-lead though-hole mounted DIP package, row spacing 26.67mm (1050 mils), SMDSocket, LongPads

Pads: 64
SMD: 30.3×81.9
Boards: —

DIP-8-16_W7.62mm_Socket

FP—

Package_DIP

16-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket

Pads: 8
THT: 10.7×25.9
Boards: —

DIP-8-16_W7.62mm_Socket_LongPads

FP—

Package_DIP

16-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads

Pads: 8
THT: 10.7×25.9
Boards: —

DIP-8-N6_W7.62mm

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), missing pin 6

Pads: 7
THT: 9.8×10.7
Boards: —

Fairchild_LSOP-8

FP—

Package_DIP

8-lead, 300 mils wide, surface mount package (https://www.fairchildsemi.com/package-drawings/ML/MLSOP08A.pdf)

Pads: 8
SMD: 11.2×10.2
Boards: —

IXYS_Flatpak-8_6.3x9.7mm_P2.54mm

FP3D

Package_DIP

IXYS Flatpak, 8 Pin (https://www.littelfuse.com/media?resourcetype=datasheets&itemid=996c6e8f-cc1b-44f6-811e-251c6e004c56&filename=littelfuse-integrated-circuits-loc112-datasheet)

Pads: 8
SMD: 10.8×10.2
Boards: —

IXYS_SMD-8_6.3x9.7mm_P2.54mm

FP3D

Package_DIP

IXYS Flatpak, 8 Pin (https://www.littelfuse.com/media?resourcetype=datasheets&itemid=996c6e8f-cc1b-44f6-811e-251c6e004c56&filename=littelfuse-integrated-circuits-loc112-datasheet)

Pads: 8
SMD: 11.1×10.2
Boards: —

PowerIntegrations_eDIP-12B

FP3D

Package_DIP

Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf

Pads: 11
THT: 12.1×10.8
Boards: —

PowerIntegrations_PDIP-8B

FP3D

Package_DIP

Power Integrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/lnk520.pdf

Pads: 7
THT: 10.6×10.7
Boards: —

PowerIntegrations_PDIP-8C

FP3D

Package_DIP

Power Integrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf

Pads: 7
THT: 10.6×10.7
Boards: —

PowerIntegrations_SDIP-10C

FP3D

Package_DIP

PowerIntegrations variant of 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf

Pads: 9
THT: 10.6×13.3
Boards: —

PowerIntegrations_SMD-8C

FP3D

Package_DIP

PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf

Pads: 7
SMD: 11.1×10.7
Boards: —