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Footprints

14 footprints matching “20”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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SymbolFootprint3D model

Footprints on their own, whether or not a symbol uses them.

14 footprints

Matched by name and keywords. Search by meaning instead

DIP-20_W7.62mm

FP3D

Package_DIP

20-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)

Pads
20
THT
9.7×25.9
Boards
318

DIP-20_W7.62mm_Socket

FP3D

Package_DIP

20-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket

Pads
20
THT
10.7×26.0
Boards
227

DIP-20_W7.62mm_Socket_LongPads

FP3D

Package_DIP

20-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads

Pads
20
THT
10.7×26.0
Boards
100

DIP-20_W7.62mm_LongPads

FP3D

Package_DIP

20-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads

Pads
20
THT
10.5×25.9
Boards
84

CERDIP-20_W7.62mm_SideBrazed

FP—

Package_DIP

20-lead through-hole mounted CERDIP, JEDEC MS-015-AE package, row spacing 7.62mm (300 mils), SideBrazed, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads
20
THT
9.7×25.9
Boards
1

CERDIP-20_W7.62mm_SideBrazed_LongPads

FP—

Package_DIP

20-lead through-hole mounted CERDIP, JEDEC MS-015-AE package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads
20
THT
10.5×25.9
Boards
1

CERDIP-20_W7.62mm_SideBrazed_Socket

FP—

Package_DIP

20-lead through-hole mounted CERDIP, JEDEC MS-015-AE package, row spacing 7.62mm (300 mils), SideBrazed, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads
20
THT
10.7×26.0
Boards
1

DIP-20_W8.89mm_SMDSocket_LongPads

FP3D

Package_DIP

20-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads

Pads
20
SMD
12.5×26.0
Boards
1

CERDIP-20_W7.62mm_SideBrazed_LongPads_Socket

FP—

Package_DIP

20-lead through-hole mounted CERDIP, JEDEC MS-015-AE package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads
20
THT
10.7×26.0
Boards
—

DIP-20_W7.62mm_SMDSocket_SmallPads

FP3D

Package_DIP

20-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads

Pads
20
SMD
10.7×26.0
Boards
—

SMDIP-20_W11.48mm

FP3D

Package_DIP

20-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)

Pads
20
SMD
14.0×25.9
Boards
—

SMDIP-20_W7.62mm

FP3D

Package_DIP

20-lead surface-mounted (SMD) DIP package, row spacing 7.62mm (300 mils)

Pads
20
SMD
10.1×25.9
Boards
—

SMDIP-20_W9.53mm

FP3D

Package_DIP

20-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils)

Pads
20
SMD
12.0×25.9
Boards
—

SMDIP-20_W9.53mm_Clearance8mm

FP3D

Package_DIP

20-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils), Clearance8mm

Pads
20
SMD
11.5×25.9
Boards
—