Footprints
7 footprints matching “Integrations”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
PowerIntegrations_SMD-8
Package_DIP
PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see https://www.power.com/sites/default/files/product-docs/lnk520.pdf
- Pads
- 8
- SMD
- 11.1×10.7
- Boards
- 3
PowerIntegrations_SMD-8B
Package_DIP
PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see https://www.power.com/sites/default/files/product-docs/lnk520.pdf
- Pads
- 7
- SMD
- 11.1×10.7
- Boards
- 2
PowerIntegrations_eDIP-12B
Package_DIP
Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf
- Pads
- 11
- THT
- 12.1×10.8
- Boards
- —
PowerIntegrations_PDIP-8B
Package_DIP
Power Integrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/lnk520.pdf
- Pads
- 7
- THT
- 10.6×10.7
- Boards
- —
PowerIntegrations_PDIP-8C
Package_DIP
Power Integrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf
- Pads
- 7
- THT
- 10.6×10.7
- Boards
- —
PowerIntegrations_SDIP-10C
Package_DIP
PowerIntegrations variant of 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf
- Pads
- 9
- THT
- 10.6×13.3
- Boards
- —
PowerIntegrations_SMD-8C
Package_DIP
PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf
- Pads
- 7
- SMD
- 11.1×10.7
- Boards
- —