PowerIntegrations_SMD-8

Package_DIP

PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see https://www.power.com/sites/default/files/product-docs/lnk520.pdf

Footprint

8 pads
Footprint PowerIntegrations_SMD-8
Mount
Surface mount
Courtyard
11.1 × 10.66 mm
Pads
8
File
5 KB

3D model

STEP

Package_DIP_PowerIntegrations_SMD-8

8.95 × 10.24 × 3.68 mm

244 KB STEP

Library
Package_DIP_PowerIntegrations
Model page
Open →

Parts that use it

2 components in the catalog place this footprint

On real boards

The largest boards that carry it

DesignPartsNetsLayersBoardLicenceSource
Drumkid BOARD67190290 × 140 mmCC-BY-4.0sinitsinmike/drumkid
Drumkid BOARD96990290 × 140 mmCC-BY-4.0sinitsinmike/drumkid
Micro Midi1919236 × 25 mmApache-2.0mendelt/micro-midi

Provenance

Credit
KiCad Libraries Contributors
Licence
CC-BY-SA-4.0-with-KiCad-exception