Footprints

33 footprints matching “3.9”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints that come with a 3D model.

33 footprints · page 1 of 2

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SOIC-8_3.9x4.9mm_P1.27mm

FP3D

Package_SO

SOIC, 8 Pin (JEDEC MS-012AA, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_narrow-r/r_8.pdf)

Pads: 8
SMD: 7.4×5.4
Boards: 3,516

SOIC-16_3.9x9.9mm_P1.27mm

FP3D

Package_SO

SOIC, 16 Pin (JEDEC MS-012, variation AC, https://www.jedec.org/document_search?search_api_views_fulltext=MS-012, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_narrow-r/r_16.pdf)

Pads: 16
SMD: 7.4×10.4
Boards: 1,078

SOIC-14_3.9x8.7mm_P1.27mm

FP3D

Package_SO

SOIC, 14 Pin (JEDEC MS-012AB, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_narrow-r/r_14.pdf)

Pads: 14
SMD: 7.4×9.2
Boards: 908

SO-8_3.9x4.9mm_P1.27mm

FP3D

Package_SO

SO, 8 Pin (https://www.nxp.com/docs/en/data-sheet/PCF8523.pdf)

Pads: 8
SMD: 7.4×5.4
Boards: 380

SO-14_3.9x8.65mm_P1.27mm

FP3D

Package_SO

SO, 14 Pin (https://www.st.com/resource/en/datasheet/l6491.pdf)

Pads: 14
SMD: 7.4×9.2
Boards: 147

SO-16_3.9x9.9mm_P1.27mm

FP3D

Package_SO

SO, 16 Pin (https://www.nxp.com/docs/en/package-information/SOT109-1.pdf)

Pads: 16
SMD: 7.4×10.4
Boards: 141

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm

FP3D

Package_SO

SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)

Pads: 9
SMD: 7.4×5.4
Boards: 135

SSOP-16_3.9x4.9mm_P0.635mm

FP3D

Package_SO

SSOP, 16 Pin (https://www.nxp.com/docs/en/package-information/SOT519-1.pdf#page=2)

Pads: 16
SMD: 7.4×5.4
Boards: 98

SSOP-20_3.9x8.7mm_P0.635mm

FP3D

Package_SO

SSOP20: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf)

Pads: 20
SMD: 6.9×9.3
Boards: 54

Texas_HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.4x3.1mm_ThermalVias

FP3D

Package_SO

8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf

Pads: 9
SMD: 8.4×5.5
Boards: 47

QSOP-16_3.9x4.9mm_P0.635mm

FP3D

Package_SO

QSOP, 16 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0055.PDF)

Pads: 16
SMD: 7.4×5.4
Boards: 45

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm_ThermalVias

FP3D

Package_SO

SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)

Pads: 9
SMD: 7.4×5.4
Boards: 40

SSOP-8_3.9x5.05mm_P1.27mm

FP3D

Package_SO

SSOP, 8 Pin (https://www.fujitsu.com/uk/Images/MB85RS16.pdf)

Pads: 8
SMD: 7.4×5.6
Boards: 34

SSOP-10-1EP_3.9x4.9mm_P1mm_EP2.1x3.3mm

FP3D

Package_SO

SSOP, 10 Pin (http://download.py32.org/%E6%95%B0%E6%8D%AE%E6%89%8B%E5%86%8C/zh-CN/PY32F002A%20%E7%B3%BB%E5%88%97%E6%95%B0%E6%8D%AE%E6%89%8B%E5%86%8C_Rev1.0.pdf#page=44)

Pads: 11
SMD: 7.5×5.4
Boards: 33

SSOP-28_3.9x9.9mm_P0.635mm

FP3D

Package_SO

SSOP28: plastic shrink small outline package; 28 leads; body width 3.9 mm; lead pitch 0.635; (see http://cds.linear.com/docs/en/datasheet/38901fb.pdf)

Pads: 28
SMD: 6.9×10.4
Boards: 33