Footprints
397 footprints
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
SO-4_4.4x4.3mm_P2.54mm
Package_SO
4-Lead Plastic Small Outline (SO), see https://docs.broadcom.com/docs/AV02-0173EN
- Pads
- 4
- SMD
- 7.7×4.8
- Boards
- 24
Diodes_SO-8EP
Package_SO
8-Lead Plastic SO, Exposed Die Pad (see https://www.diodes.com/assets/Package-Files/SO-8EP.pdf)
- Pads
- 9
- SMD
- 7.0×5.1
- Boards
- 22
SSOP-16_4.4x5.2mm_P0.65mm
Package_SO
SSOP16: plastic shrink small outline package; 16 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot369-1_po.pdf)
- Pads
- 16
- SMD
- 7.3×5.8
- Boards
- 22
SSOP-8_3.95x5.21x3.27mm_P1.27mm
Package_SO
SSOP-8 3.95x5.21x3.27mm Pitch 1.27mm
- Pads
- 8
- SMD
- 7.2×5.7
- Boards
- 22
HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.4x3.2mm
Package_SO
HTSOP, 8 Pin (https://media.digikey.com/pdf/Data%20Sheets/Rohm%20PDFs/BD9G341EFJ.pdf)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 20
SO-24_5.3x15mm_P1.27mm
Package_SO
SO, 24 Pin (https://www.ti.com/lit/ml/msop002a/msop002a.pdf)
- Pads
- 24
- SMD
- 9.4×15.5
- Boards
- 19
SO-16_5.3x10.2mm_P1.27mm
Package_SO
SO, 16 Pin (https://www.ti.com/lit/ml/msop002a/msop002a.pdf)
- Pads
- 16
- SMD
- 9.4×10.7
- Boards
- 17
SOIC-8_7.5x5.85mm_P1.27mm
Package_SO
SOIC, 8 Pin (http://www.ti.com/lit/ml/mpds382b/mpds382b.pdf)
- Pads
- 8
- SMD
- 13.0×6.4
- Boards
- 17
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.81mm
Package_SO
SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 17
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.514x3.2mm
Package_SO
SOIC, 8 Pin (https://www.renesas.com/eu/en/www/doc/datasheet/hip2100.pdf#page=13)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 17
HTSSOP-56-1EP_6.1x14mm_P0.5mm_EP3.61x6.35mm
Package_SO
HTSSOP56: plastic thin shrink small outline package http://www.ti.com/lit/ds/symlink/drv8301.pdf
- Pads
- 57
- SMD
- 9.6×14.6
- Boards
- 16
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.71x3.4mm_ThermalVias
Package_SO
SOIC, 8 Pin (JEDEC MS-012 variation BA (thermally enhanced), using tolerances and Exposed Pad from Texas Instruments DDA0008B, https://www.ti.com/lit/ml/pptd058j/pptd058j.pdf, https://www.ti.com/lit/ds/symlink/lm5017.pdf#page=35, https://www.jedec.org/document_search?search_api_views_fulltext=MS-012)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 16
SOIC-4_4.55x2.6mm_P1.27mm
Package_SO
SOIC, 4 Pin (https://toshiba.semicon-storage.com/info/docget.jsp?did=12884&prodName=TLP291)
- Pads
- 4
- SMD
- 8.6×3.1
- Boards
- 15
SSOP-16_5.3x6.2mm_P0.65mm
Package_SO
SSOP, 16 Pin (https://assets.nexperia.com/documents/data-sheet/74HC_HCT165.pdf#page=14)
- Pads
- 16
- SMD
- 9.1×6.7
- Boards
- 15
HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.4x3.2mm_ThermalVias
Package_SO
HTSOP, 8 Pin (https://media.digikey.com/pdf/Data%20Sheets/Rohm%20PDFs/BD9G341EFJ.pdf)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 14
MSOP-8-1EP_3x3mm_P0.65mm_EP1.68x1.88mm
Package_SO
MSOP, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/4440fb.pdf#page=13)
- Pads
- 9
- SMD
- 6.3×3.5
- Boards
- 14
SSOP-14_5.3x6.2mm_P0.65mm
Package_SO
SSOP, 14 Pin (JEDEC MO-150 variation AB, 1.75mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-150)
- Pads
- 14
- SMD
- 9.4×6.7
- Boards
- 14
HSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.3x2.3mm
Package_SO
HSOP, 8 Pin (https://www.st.com/resource/en/datasheet/l7980.pdf)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 13
HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.85x5.4mm_ThermalVias
Package_SO
HTSSOP, 28 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0108.PDF)
- Pads
- 29
- SMD
- 7.7×10.2
- Boards
- 13
PowerIntegrations_SO-8
Package_SO
Power-Integrations variant of 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf
- Pads
- 8
- SMD
- 8.0×5.4
- Boards
- 13
SOP-20_7.5x12.8mm_P1.27mm
Package_SO
SOP, 20 Pin (https://www.holtek.com/documents/10179/116723/sop20-300.pdf)
- Pads
- 20
- SMD
- 11.6×13.3
- Boards
- 13
SSO-8_6.8x5.9mm_P1.27mm_Clearance8mm
Package_SO
8-Lead Plastic Stretched Small Outline (SSO/Stretched SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true
- Pads
- 8
- SMD
- 13.1×6.4
- Boards
- 13
Infineon_PG-DSO-12-11
Package_SO
Infineon PG-DSO 12 pin, exposed pad: 4.5x8.1mm, (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-12-11/)
- Pads
- 13
- SMD
- 12.1×8.6
- Boards
- 12
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.81mm_ThermalVias
Package_SO
SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 11