Footprints
397 footprints
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
SOIC-20W_7.5x15.4mm_P1.27mm
Package_SO
SOIC, 20 Pin (JEDEC MS-013AD, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_wide-rw/RI_20_1.pdf)
- Pads
- 20
- SMD
- 11.8×15.9
- Boards
- 4
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.71x3.4mm
Package_SO
SOIC, 8 Pin (JEDEC MS-012 variation BA (thermally enhanced), using tolerances and Exposed Pad from Texas Instruments DDA0008B, https://www.ti.com/lit/ml/pptd058j/pptd058j.pdf, https://www.ti.com/lit/ds/symlink/lm5017.pdf#page=35, https://www.jedec.org/document_search?search_api_views_fulltext=MS-012)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 4
SOIC-8-N7_3.9x4.9mm_P1.27mm
Package_SO
8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], pin 7 removed (Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF)
- Pads
- 7
- SMD
- 7.5×5.4
- Boards
- 4
SOP-18_7x12.5mm_P1.27mm
Package_SO
SOP, 18 Pin (https://toshiba.semicon-storage.com/info/docget.jsp?did=30523)
- Pads
- 18
- SMD
- 11.8×13.0
- Boards
- 4
SSO-8_6.7x9.8mm_P2.54mm_Clearance8mm
Package_SO
8-Lead Plastic Stretched Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/83831/lh1533ab.pdf
- Pads
- 8
- SMD
- 11.9×10.3
- Boards
- 4
TSOP-I-32_11.8x8mm_P0.5mm
Package_SO
TSOP-I, 32 Pin (http://www.issi.com/WW/pdf/61-64C5128AL.pdf)
- Pads
- 32
- SMD
- 14.9×8.5
- Boards
- 4
TSOP-I-32_12.4x8mm_P0.5mm
Package_SO
TSOP-I, 32 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation BA)
- Pads
- 32
- SMD
- 15.5×8.5
- Boards
- 4
TSSOP-14-1EP_4.4x5mm_P0.65mm
Package_SO
14-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] with exposed pad (http://cds.linear.com/docs/en/datasheet/34301fa.pdf)
- Pads
- 15
- SMD
- 7.9×5.6
- Boards
- 4
HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask2.66x2.46mm_ThermalVias
Package_SO
HTSSOP, 16 Pin (http://www.ti.com/lit/ds/symlink/tps2660.pdf#page=48)
- Pads
- 17
- SMD
- 7.8×5.5
- Boards
- 3
HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.75x6.2mm
Package_SO
HTSSOP, 28 Pin (https://www.trinamic.com/fileadmin/assets/Support/AppNotes/AN005x-IC_Package_PCB_Footprint_Guidelines_HTSSOP28_rev1.00.pdf)
- Pads
- 29
- SMD
- 7.8×10.2
- Boards
- 3
HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.75x6.2mm_ThermalVias
Package_SO
HTSSOP, 28 Pin (https://www.trinamic.com/fileadmin/assets/Support/AppNotes/AN005x-IC_Package_PCB_Footprint_Guidelines_HTSSOP28_rev1.00.pdf)
- Pads
- 29
- SMD
- 7.8×10.2
- Boards
- 3
HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.85x5.4mm
Package_SO
HTSSOP, 28 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0108.PDF)
- Pads
- 29
- SMD
- 7.7×10.2
- Boards
- 3
HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm_Mask2.4x6.17mm_ThermalVias
Package_SO
HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad
- Pads
- 29
- SMD
- 7.3×10.3
- Boards
- 3
HVSSOP-8-1EP_3x3mm_P0.65mm_EP1.57x1.89mm_ThermalVias
Package_SO
HVSSOP, 8 Pin (https://www.ti.com/lit/ds/symlink/tpa6110a2.pdf)
- Pads
- 9
- SMD
- 6.3×3.5
- Boards
- 3
Infineon_PG-DSO-12-9
Package_SO
Infineon PG-DSO 12 pin, exposed pad: 4.5x8.1mm, (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-12-9/)
- Pads
- 13
- SMD
- 12.1×8.6
- Boards
- 3
Infineon_PG-DSO-8-27_3.9x4.9mm_EP2.65x3mm
Package_SO
Infineon PG-DSO, 8 Pin (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-8-27)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 3
MSOP-16-1EP_3x4.039mm_P0.5mm_EP1.651x2.845mm_ThermalVias
Package_SO
MSOP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-msop/05081667_F_MSE16.pdf)
- Pads
- 17
- SMD
- 6.3×4.5
- Boards
- 3
MSOP-8-1EP_3x3mm_P0.65mm_EP1.5x1.8mm
Package_SO
MSOP, 8 Pin (https://www.diodes.com/assets/Package-Files/MSOP-8EP.pdf)
- Pads
- 9
- SMD
- 6.3×3.5
- Boards
- 3
MSOP-8-1EP_3x3mm_P0.65mm_EP1.5x1.8mm_ThermalVias
Package_SO
MSOP, 8 Pin (https://www.diodes.com/assets/Package-Files/MSOP-8EP.pdf)
- Pads
- 9
- SMD
- 6.3×3.5
- Boards
- 3
MSOP-8-1EP_3x3mm_P0.65mm_EP1.73x1.85mm_ThermalVias
Package_SO
MSOP, 8 Pin (http://www.ti.com/lit/ds/symlink/lm25085.pdf#page=32)
- Pads
- 9
- SMD
- 6.3×3.5
- Boards
- 3
MSOP-8-1EP_3x3mm_P0.65mm_EP1.95x2.15mm_ThermalVias
Package_SO
MSOP, 8 Pin (http://www.st.com/resource/en/datasheet/pm8834.pdf)
- Pads
- 9
- SMD
- 6.3×3.5
- Boards
- 3
MSOP-8-1EP_3x3mm_P0.65mm_EP2.5x3mm_Mask1.73x2.36mm
Package_SO
MSOP, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf#page=15)
- Pads
- 9
- SMD
- 6.2×3.5
- Boards
- 3
PowerIntegrations_SO-8C
Package_SO
Power-Integrations variant of 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf
- Pads
- 7
- SMD
- 7.4×5.4
- Boards
- 3
QSOP-20_3.9x8.7mm_P0.635mm
Package_SO
QSOP, 20 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0055.PDF)
- Pads
- 20
- SMD
- 7.4×9.2
- Boards
- 3