Footprints

27 footprints matching “24”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

27 footprints · page 1 of 2

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TSSOP-24_4.4x7.8mm_P0.65mm

FP3D

Package_SO

TSSOP, 24 Pin (JEDEC MO-153 variation AD, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 24
SMD: 7.7×8.3
Boards: 242

SOIC-24W_7.5x15.4mm_P1.27mm

FP3D

Package_SO

SOIC, 24 Pin (JEDEC MS-013AD, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_wide-rw/RW_24.pdf)

Pads: 24
SMD: 11.9×15.9
Boards: 141

SSOP-24_5.3x8.2mm_P0.65mm

FP3D

Package_SO

SSOP, 24 Pin (JEDEC MO-150 variation AG, 1.75mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-150, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=398, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-ssop/ssop_24_05-08-1640.pdf)

Pads: 24
SMD: 9.4×8.7
Boards: 111

SSOP-20_3.9x8.7mm_P0.635mm

FP3D

Package_SO

SSOP20: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf)

Pads: 20
SMD: 6.9×9.3
Boards: 54

SSOP-24_3.9x8.7mm_P0.635mm

FP3D

Package_SO

SSOP24: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot556-1_po.pdf)

Pads: 24
SMD: 6.9×9.3
Boards: 30

SOP-24_7.5x15.4mm_P1.27mm

FP—

Package_SO

SOP, 24 Pin (http://www.issi.com/WW/pdf/31FL3218.pdf#page=14)

Pads: 24
SMD: 11.8×15.9
Boards: 25

SO-24_5.3x15mm_P1.27mm

FP—

Package_SO

SO, 24 Pin (https://www.ti.com/lit/ml/msop002a/msop002a.pdf)

Pads: 24
SMD: 9.4×15.5
Boards: 19

QSOP-24_3.9x8.7mm_P0.635mm

FP3D

Package_SO

QSOP, 24 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0055.PDF)

Pads: 24
SMD: 7.4×9.2
Boards: 10

HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.4x4.68mm_ThermalVias

FP3D

Package_SO

HTSSOP, 24 Pin (http://www.ti.com/lit/ds/symlink/tps703.pdf)

Pads: 25
SMD: 7.8×8.3
Boards: 9

TSSOP-24_6.1x7.8mm_P0.65mm

FP3D

Package_SO

TSSOP, 24 Pin (JEDEC MO-153 Var DA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 24
SMD: 9.4×8.3
Boards: 7

HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.2x5mm

FP—

Package_SO

HTSSOP, 24 Pin (JEDEC MO-153 variation ADT, 1.00mm body thickness, custom Exposed Pad size from STMicroelectronics, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153, https://www.st.com/resource/en/datasheet/stp16cp05.pdf#page=25, https://www.st.com/resource/en/datasheet/led1642gw.pdf#page=37)

Pads: 25
SMD: 7.8×8.3
Boards: 4

TSSOP-24_4.4x5mm_P0.4mm

FP3D

Package_SO

TSSOP, 24 Pin (JEDEC MO-153 Var CA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 24
SMD: 7.7×5.5
Boards: 2

HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.44x3.42mm

FP—

Package_SO

HTSSOP, 24 Pin (Texas Instruments PWP0024U, based on JEDEC MO-153 variation ADT, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd402/pptd402.pdf, https://www.ti.com/lit/ds/symlink/tlc5949.pdf#page=50, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 25
SMD: 7.8×8.3
Boards: —

HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.44x3.42mm_ThermalVias

FP—

Package_SO

Pads: 25
SMD: 7.8×8.3
Boards: —

HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.4x2.98mm

FP—

Package_SO

HTSSOP, 24 Pin (Texas Instruments PWP0024P, based on JEDEC MO-153 variation ADT, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd064i/pptd064i.pdf, https://web.archive.org/web/20170223145154/http://www.ti.com/lit/ds/symlink/tlc5949.pdf#page=49, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 25
SMD: 7.8×8.3
Boards: —

HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.4x2.98mm_ThermalVias

FP—

Package_SO

Pads: 25
SMD: 7.8×8.3
Boards: —

HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.4x4.68mm

FP3D

Package_SO

HTSSOP, 24 Pin (http://www.ti.com/lit/ds/symlink/tps703.pdf)

Pads: 25
SMD: 7.8×8.3
Boards: —

Infineon_PG-DSO-8-24_4x5mm

FP3D

Package_SO

Infineon PG-DSO, 8 Pin (https://www.infineon.com/dgdl/Infineon-BSP752R-DS-v01_02-EN.pdf?fileId=db3a304316f112290116f233cbd271e9#page=17)

Pads: 8
SMD: 7.4×5.5
Boards: —

SOJ-24_7.62x15.875mm_P1.27mm

FP—

Package_SO

SOJ, 24 Pin (JEDEC MS-023-A, 300 mils width, variation AA, https://www.jedec.org/system/files/docs/Ms-023a.pdf)

Pads: 24
SMD: 9.8×16.4
Boards: —

ST_PowerSSO-24_SlugDown

FP3D

Package_SO

ST PowerSSO-24 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7266p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)

Pads: 25
SMD: 12.1×10.8
Boards: —

ST_PowerSSO-24_SlugDown_ThermalVias

FP3D

Package_SO

ST PowerSSO-24 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7266p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)

Pads: 25
SMD: 12.1×10.8
Boards: —

ST_PowerSSO-24_SlugUp

FP3D

Package_SO

ST PowerSSO-24 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7266p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)

Pads: 24
SMD: 12.1×10.8
Boards: —