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Footprints

4 footprints matching “3.4mm”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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SymbolFootprint3D model

Footprints on their own, whether or not a symbol uses them.

4 footprints

Matched by name and keywords. Search by meaning instead

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.71x3.4mm_ThermalVias

FP—

Package_SO

SOIC, 8 Pin (JEDEC MS-012 variation BA (thermally enhanced), using tolerances and Exposed Pad from Texas Instruments DDA0008B, https://www.ti.com/lit/ml/pptd058j/pptd058j.pdf, https://www.ti.com/lit/ds/symlink/lm5017.pdf#page=35, https://www.jedec.org/document_search?search_api_views_fulltext=MS-012)

Pads
9
SMD
7.4×5.4
Boards
16

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.71x3.4mm

FP—

Package_SO

SOIC, 8 Pin (JEDEC MS-012 variation BA (thermally enhanced), using tolerances and Exposed Pad from Texas Instruments DDA0008B, https://www.ti.com/lit/ml/pptd058j/pptd058j.pdf, https://www.ti.com/lit/ds/symlink/lm5017.pdf#page=35, https://www.jedec.org/document_search?search_api_views_fulltext=MS-012)

Pads
9
SMD
7.4×5.4
Boards
4

NXP_HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.2x3.4mm

FP—

Package_SO

HTSSOP, 28 Pin (https://www.nxp.com/docs/en/package-information/SOT1172-3.pdf)

Pads
29
SMD
8.0×10.3
Boards
—

NXP_HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.2x3.4mm_ThermalVias

FP—

Package_SO

HTSSOP, 28 Pin (https://www.nxp.com/docs/en/package-information/SOT1172-3.pdf)

Pads
29
SMD
8.0×10.3
Boards
—