Footprints
17 footprints matching “6.5mm”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
TSSOP-20_4.4x6.5mm_P0.65mm
Package_SO
TSSOP, 20 Pin (JEDEC MO-153 Var AC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 20
- SMD
- 7.7×7.0
- Boards
- 731
SSOP-20_4.4x6.5mm_P0.65mm
Package_SO
SSOP, 20 Pin (https://www.jedec.org/system/files/docs/Mo-152c.pdf)
- Pads
- 20
- SMD
- 7.8×7.0
- Boards
- 39
ETSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3x4.2mm
Package_SO
20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body with Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 21
- SMD
- 7.9×7.1
- Boards
- 7
HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm_Mask2.75x3.43mm_ThermalVias
Package_SO
HTSSOP, 20 Pin (http://www.ti.com/lit/ds/symlink/tlc5971.pdf#page=37&zoom=160,-90,3)
- Pads
- 21
- SMD
- 7.8×7.0
- Boards
- 6
HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP2.85x4mm
Package_SO
HTSSOP, 20 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0108.PDF)
- Pads
- 21
- SMD
- 7.7×7.0
- Boards
- 4
SSOP-18_4.4x6.5mm_P0.65mm
Package_SO
SSOP18: plastic shrink small outline package; 18 leads; body width 4.4 mm (http://toshiba.semicon-storage.com/info/docget.jsp?did=30523&prodName=TBD62783APG)
- Pads
- 18
- SMD
- 6.9×7.0
- Boards
- 3
HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP2.74x3.86mm
Package_SO
HTSSOP, 20 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/4011fb.pdf#page=24)
- Pads
- 21
- SMD
- 7.7×7.0
- Boards
- 2
HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm_Mask2.4x3.7mm
Package_SO
HTSSOP, 20 Pin (http://www.ti.com/lit/ds/symlink/bq24006.pdf)
- Pads
- 21
- SMD
- 7.8×7.0
- Boards
- 1
HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm_Mask2.96x2.96mm_ThermalVias
Package_SO
HTSSOP, 20 Pin (https://www.ti.com/lit/ds/symlink/tps2663.pdf#page=49)
- Pads
- 21
- SMD
- 7.8×7.0
- Boards
- 1
HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm_ThermalVias
Package_SO
20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [HTSSOP], with thermal pad with vias
- Pads
- 21
- SMD
- 7.9×7.1
- Boards
- 1
TSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP2.15x3.35mm
Package_SO
TSSOP, 20 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-100132.PDF)
- Pads
- 21
- SMD
- 7.8×7.0
- Boards
- 1
HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm
Package_SO
20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [HTSSOP], with thermal pad with vias
- Pads
- 21
- SMD
- 7.9×7.1
- Boards
- —
HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm_Mask2.75x3.43mm
Package_SO
HTSSOP, 20 Pin (http://www.ti.com/lit/ds/symlink/tlc5971.pdf#page=37&zoom=160,-90,3)
- Pads
- 21
- SMD
- 7.8×7.0
- Boards
- —
HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm_Mask2.96x2.96mm
Package_SO
HTSSOP, 20 Pin (https://www.ti.com/lit/ds/symlink/tps2663.pdf#page=49)
- Pads
- 21
- SMD
- 7.8×7.0
- Boards
- —
Texas_PW0020A_TSSOP-20_4.4x6.5mm_P0.65mm
Package_SO
Texas PW0020A TSSOP, 20 Pin (https://www.ti.com/lit/ml/mpds362a/mpds362a.pdf)
- Pads
- 20
- SMD
- 7.8×7.0
- Boards
- —
TSSOP-24_4.4x6.5mm_P0.5mm
Package_SO
TSSOP, 24 Pin (JEDEC MO-153 Var BB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 24
- SMD
- 7.7×7.0
- Boards
- —
TSSOP-32_4.4x6.5mm_P0.4mm
Package_SO
TSSOP, 32 Pin (JEDEC MO-153 Var CB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 32
- SMD
- 7.7×7.0
- Boards
- —