ETSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3x4.2mm

Package_SO

20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body with Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf)

Footprint

21 pads
Footprint ETSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3x4.2mm
Mount
Surface mount
Courtyard
7.9 × 7.1 mm
Pads
21
File
7 KB

3D model

STEP

Package_SO_ETSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3x4.2mm

6.40 × 6.50 × 1.10 mm

268 KB STEP

Library
Package_SO_ETSSOP-20-1EP_4.4x6.5mm_P0.65mm
Model page
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Parts that use it

2 components in the catalog place this footprint

On real boards

The largest boards that carry it

Provenance

Credit
KiCad Libraries Contributors
Licence
CC-BY-SA-4.0-with-KiCad-exception