Footprints
67 footprints matching “8-pin”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
SOIC-8_3.9x4.9mm_P1.27mm
Package_SO
SOIC, 8 Pin (JEDEC MS-012AA, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_narrow-r/r_8.pdf)
- Pads
- 8
- SMD
- 7.4×5.4
- Boards
- 3,516
SO-8_3.9x4.9mm_P1.27mm
Package_SO
SO, 8 Pin (https://www.nxp.com/docs/en/data-sheet/PCF8523.pdf)
- Pads
- 8
- SMD
- 7.4×5.4
- Boards
- 380
MSOP-8_3x3mm_P0.65mm
Package_SO
MSOP, 8 Pin (https://www.jedec.org/system/files/docs/mo-187F.pdf variant AA)
- Pads
- 8
- SMD
- 6.4×3.5
- Boards
- 348
TSSOP-8_4.4x3mm_P0.65mm
Package_SO
TSSOP, 8 Pin (JEDEC MO-153 Var AA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 8
- SMD
- 7.7×3.5
- Boards
- 179
VSSOP-8_2.3x2mm_P0.5mm
Package_SO
VSSOP, 8 Pin (https://www.jedec.org/standards-documents/docs/mo-187-f)
- Pads
- 8
- SMD
- 4.6×2.5
- Boards
- 156
SOIC-8_5.3x5.3mm_P1.27mm
Package_SO
SOIC, 8 Pin (JEITA/EIAJ ED-7311-19 variation 08-001-BBA and Atmel/Microchip, 208 mils width, https://www.jeita.or.jp/japanese/standard/book/ED-7311-19/#target/page_no=21, https://ww1.microchip.com/downloads/en/DeviceDoc/20005045C.pdf#page=23, https://ww1.microchip.com/downloads/en/DeviceDoc/doc2535.pdf#page=162)
- Pads
- 8
- SMD
- 9.3×5.8
- Boards
- 139
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm
Package_SO
SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 135
TI_SO-PowerPAD-8_ThermalVias
Package_SO
8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias with large copper area, as proposed in http://www.ti.com/lit/ds/symlink/tps5430.pdf
- Pads
- 9
- SMD
- 7.5×5.5
- Boards
- 103
Texas_HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.4x3.1mm_ThermalVias
Package_SO
8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf
- Pads
- 9
- SMD
- 8.4×5.5
- Boards
- 47
SOP-8_3.76x4.96mm_P1.27mm
Package_SO
SOP, 8 Pin (https://ww2.minicircuits.com/case_style/XX211.pdf)
- Pads
- 8
- SMD
- 7.6×5.5
- Boards
- 44
SOP-8_6.62x9.15mm_P2.54mm
Package_SO
SOP, 8 Pin (http://www.ti.com/lit/ds/symlink/iso1050.pdf)
- Pads
- 8
- SMD
- 11.9×9.7
- Boards
- 43
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm_ThermalVias
Package_SO
SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 40
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm_ThermalVias
Package_SO
SOIC, 8 Pin (http://www.allegromicro.com/~/media/Files/Datasheets/A4950-Datasheet.ashx#page=8)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 38
SSOP-8_3.9x5.05mm_P1.27mm
Package_SO
SSOP, 8 Pin (https://www.fujitsu.com/uk/Images/MB85RS16.pdf)
- Pads
- 8
- SMD
- 7.4×5.6
- Boards
- 34
VSSOP-8_3x3mm_P0.65mm
Package_SO
VSSOP, 8 Pin (https://www.jedec.org/standards-documents/docs/mo-187-f)
- Pads
- 8
- SMD
- 6.4×3.5
- Boards
- 29
HSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.1mm_ThermalVias
Package_SO
HSOP, 8 Pin (https://www.st.com/resource/en/datasheet/l5973d.pdf)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 28
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm
Package_SO
SOIC, 8 Pin (http://www.allegromicro.com/~/media/Files/Datasheets/A4950-Datasheet.ashx#page=8)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 28
HSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.1mm
Package_SO
HSOP, 8 Pin (https://www.st.com/resource/en/datasheet/l5973d.pdf)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 25
HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.4x3.2mm
Package_SO
HTSOP, 8 Pin (https://media.digikey.com/pdf/Data%20Sheets/Rohm%20PDFs/BD9G341EFJ.pdf)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 20
SOIC-8_7.5x5.85mm_P1.27mm
Package_SO
SOIC, 8 Pin (http://www.ti.com/lit/ml/mpds382b/mpds382b.pdf)
- Pads
- 8
- SMD
- 13.0×6.4
- Boards
- 17
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.81mm
Package_SO
SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 17
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.514x3.2mm
Package_SO
SOIC, 8 Pin (https://www.renesas.com/eu/en/www/doc/datasheet/hip2100.pdf#page=13)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 17
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.71x3.4mm_ThermalVias
Package_SO
SOIC, 8 Pin (JEDEC MS-012 variation BA (thermally enhanced), using tolerances and Exposed Pad from Texas Instruments DDA0008B, https://www.ti.com/lit/ml/pptd058j/pptd058j.pdf, https://www.ti.com/lit/ds/symlink/lm5017.pdf#page=35, https://www.jedec.org/document_search?search_api_views_fulltext=MS-012)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 16
HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.4x3.2mm_ThermalVias
Package_SO
HTSOP, 8 Pin (https://media.digikey.com/pdf/Data%20Sheets/Rohm%20PDFs/BD9G341EFJ.pdf)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 14