Footprints

3 footprints matching “Microchip”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

3 footprints

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TSSOP-16_4.4x5mm_P0.65mm

FP3D

Package_SO

TSSOP, 16 Pin (https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 16
SMD: 7.7×5.5
Boards: 579

ETSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3x4.2mm

FP3D

Package_SO

20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body with Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 21
SMD: 7.9×7.1
Boards: 7

SOIC-8-N7_3.9x4.9mm_P1.27mm

FP3D

Package_SO

8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], pin 7 removed (Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF)

Pads: 7
SMD: 7.5×5.4
Boards: 4