Footprints
3,661 footprints
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
TQFP-44_10x10mm_P0.8mm
Package_QFP
TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=658)
- Pads
- 44
- SMD
- 13.3×13.3
- Boards
- 335
MSOP-10_3x3mm_P0.5mm
Package_SO
MSOP, 10 Pin (JEDEC MO-187 variation BA, 0.85mm body thickness, https://www.jedec.org/system/files/docs/mo-187F.pdf)
- Pads
- 10
- SMD
- 6.2×3.5
- Boards
- 333
SW_SPST_B3U-1000P
Button_Switch_SMD
Ultra-small-sized Tactile Switch with High Contact Reliability, Top-actuated Model, without Ground Terminal, without Boss
- Pads
- 2
- SMD
- 4.8×3.3
- Boards
- 318
SW_SPDT_PCM12
Button_Switch_SMD
Ultraminiature Surface Mount Slide Switch, right-angle, https://www.ckswitches.com/media/1424/pcm.pdf
- Pads
- 3
- SMD
- 8.8×5.8
- Boards
- 317
SOT-23-6_Handsoldering
Package_TO_SOT_SMD
6-pin SOT-23 package, Handsoldering
- Pads
- 6
- SMD
- 4.8×3.6
- Boards
- 316
R_0201_0603Metric
Resistor_SMD
Resistor SMD 0201 (0603 Metric), square (rectangular) end terminal, IPC-7351 nominal, (Body size source: https://www.vishay.com/docs/20052/crcw0201e3.pdf)
- Pads
- 2
- SMD
- 1.4×0.7
- Boards
- 313
SOT-143
Package_TO_SOT_SMD
SOT-143 https://www.nxp.com/docs/en/package-information/SOT143B.pdf
- Pads
- 4
- SMD
- 3.2×3.4
- Boards
- 308
PinHeader_2x05_P1.27mm_Vertical_SMD
Connector_PinHeader_1.27mm
surface-mounted straight pin header, 2x05, 1.27mm pitch, double rows
- Pads
- 10
- SMD
- 8.6×7.4
- Boards
- 304
R_Array_Convex_4x0603
Resistor_SMD
Chip Resistor Network, ROHM MNR14 (see mnr_g.pdf)
- Pads
- 8
- SMD
- 3.1×3.7
- Boards
- 299
L_0603_1608Metric_Pad1.05x0.95mm_HandSolder
Inductor_SMD
Inductor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf)
- Pads
- 2
- SMD
- 3.3×1.5
- Boards
- 295
SOIC-16W_7.5x10.3mm_P1.27mm
Package_SO
SOIC, 16 Pin (JEDEC MS-013AA, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_wide-rw/rw_16.pdf)
- Pads
- 16
- SMD
- 11.9×10.8
- Boards
- 282
SOIC-20W_7.5x12.8mm_P1.27mm
Package_SO
SOIC, 20 Pin (JEDEC MS-013AC, https://www.analog.com/media/en/package-pcb-resources/package/233848rw_20.pdf)
- Pads
- 20
- SMD
- 11.9×13.3
- Boards
- 279
Fuse_1206_3216Metric_Pad1.42x1.75mm_HandSolder
Fuse
Fuse SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf)
- Pads
- 2
- SMD
- 4.9×2.3
- Boards
- 275
D_SMA_Handsoldering
Diode_SMD
Diode SMA (DO-214AC) Handsoldering
- Pads
- 2
- SMD
- 9.0×3.5
- Boards
- 273
LQFP-100_14x14mm_P0.5mm
Package_QFP
LQFP, 100 Pin (https://www.nxp.com/docs/en/package-information/SOT407-1.pdf)
- Pads
- 100
- SMD
- 17.5×17.5
- Boards
- 273
Crystal_SMD_2016-4Pin_2.0x1.6mm
Crystal
SMD2016/4, Crystal, 2.0x1.6mm package, SMD, http://www.q-crystal.com/upload/5/2015552223166229.pdf
- Pads
- 4
- SMD
- 3.0×2.6
- Boards
- 272
D_MiniMELF
Diode_SMD
Diode Mini-MELF (SOD-80, LL-34)
- Pads
- 2
- SMD
- 5.3×2.2
- Boards
- 270
D_0805_2012Metric
Diode_SMD
Diode SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC-7351 nominal, (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing)
- Pads
- 2
- SMD
- 3.4×1.9
- Boards
- 268
QFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm
Package_DFN_QFN
QFN, 24 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=278)
- Pads
- 25
- SMD
- 5.2×5.2
- Boards
- 256
TSOT-23-5
Package_TO_SOT_SMD
TSOT, 5 Pin (https://www.jedec.org/sites/default/files/docs/MO-193D.pdf variant AB)
- Pads
- 5
- SMD
- 4.1×3.4
- Boards
- 256
ESP32-S3-WROOM-1
RF_Module
2.4 GHz Wi-Fi and Bluetooth module https://www.espressif.com/sites/default/files/documentation/esp32-s3-wroom-1_wroom-1u_datasheet_en.pdf
- Pads
- 41
- SMD
- 48.0×41.2
- Boards
- 253
SSOP-28_5.3x10.2mm_P0.65mm
Package_SO
SSOP, 28 Pin (JEDEC MO-150 variation AH, 1.75mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-150, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=400)
- Pads
- 28
- SMD
- 9.4×10.7
- Boards
- 244
TSSOP-24_4.4x7.8mm_P0.65mm
Package_SO
TSSOP, 24 Pin (JEDEC MO-153 variation AD, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 24
- SMD
- 7.7×8.3
- Boards
- 242
C_1210_3225Metric_Pad1.33x2.70mm_HandSolder
Capacitor_SMD
Capacitor SMD 1210 (3225 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf)
- Pads
- 2
- SMD
- 5.0×3.2
- Boards
- 241