Footprints
301 footprints matching “0.5mm”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
LQFP-48_7x7mm_P0.5mm
Package_QFP
LQFP, 48 Pin (JEDEC MS-026 variation BBC, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-lqfp/05081760_a_lx48.pdf)
- Pads
- 48
- SMD
- 10.3×10.3
- Boards
- 862
LQFP-64_10x10mm_P0.5mm
Package_QFP
LQFP, 64 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ad7606_7606-6_7606-4.pdf)
- Pads
- 64
- SMD
- 13.4×13.4
- Boards
- 663
MSOP-10_3x3mm_P0.5mm
Package_SO
MSOP, 10 Pin (JEDEC MO-187 variation BA, 0.85mm body thickness, https://www.jedec.org/system/files/docs/mo-187F.pdf)
- Pads
- 10
- SMD
- 6.2×3.5
- Boards
- 333
LQFP-100_14x14mm_P0.5mm
Package_QFP
LQFP, 100 Pin (https://www.nxp.com/docs/en/package-information/SOT407-1.pdf)
- Pads
- 100
- SMD
- 17.5×17.5
- Boards
- 273
QFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm
Package_DFN_QFN
QFN, 24 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=278)
- Pads
- 25
- SMD
- 5.2×5.2
- Boards
- 256
QFN-32-1EP_5x5mm_P0.5mm_EP3.45x3.45mm
Package_DFN_QFN
QFN, 32 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_32_05-08-1693.pdf)
- Pads
- 33
- SMD
- 6.3×6.3
- Boards
- 176
QFN-28-1EP_5x5mm_P0.5mm_EP3.35x3.35mm
Package_DFN_QFN
QFN, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=283)
- Pads
- 29
- SMD
- 6.2×6.2
- Boards
- 175
VSSOP-8_2.3x2mm_P0.5mm
Package_SO
VSSOP, 8 Pin (https://www.jedec.org/standards-documents/docs/mo-187-f)
- Pads
- 8
- SMD
- 4.6×2.5
- Boards
- 156
TSSOP-10_3x3mm_P0.5mm
Package_SO
TSSOP, 10 Pin (https://www.ti.com/lit/ml/mpds035c/mpds035c.pdf, https://www.ti.com/lit/ds/symlink/ads1115.pdf#page=50, https://www.nxp.com/docs/en/package-information/SOT552-1.pdf)
- Pads
- 10
- SMD
- 6.3×3.5
- Boards
- 153
LGA-14_3x2.5mm_P0.5mm_LayoutBorder3x4y
Package_LGA
LGA, 14 Pin (https://www.st.com/resource/en/datasheet/lsm6ds3tr-c.pdf)
- Pads
- 14
- SMD
- 3.5×3.0
- Boards
- 118
QFN-20-1EP_4x4mm_P0.5mm_EP2.5x2.5mm
Package_DFN_QFN
QFN, 20 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=274)
- Pads
- 21
- SMD
- 5.2×5.2
- Boards
- 115
LGA-12_2x2mm_P0.5mm
Package_LGA
LGA12
- Pads
- 12
- SMD
- 2.5×2.5
- Boards
- 115
LQFP-144_20x20mm_P0.5mm
Package_QFP
LQFP, 144 Pin (JEDEC MS-026 variation BFB, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=425)
- Pads
- 144
- SMD
- 23.3×23.3
- Boards
- 104
TQFP-100_14x14mm_P0.5mm
Package_QFP
TQFP, 100 Pin (JEDEC MS-026 variation AED, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=683)
- Pads
- 100
- SMD
- 17.3×17.3
- Boards
- 93
WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm
Package_SON
8-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf
- Pads
- 9
- SMD
- 3.2×2.5
- Boards
- 87
TQFP-48_7x7mm_P0.5mm
Package_QFP
TQFP, 48 Pin (JEDEC MS-026 variation ABC, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=666)
- Pads
- 48
- SMD
- 10.3×10.3
- Boards
- 85
USON-10_2.5x1.0mm_P0.5mm
Package_SON
USON-10 2.5x1.0mm_ Pitch 0.5mm http://www.ti.com/lit/ds/symlink/tpd4e02b04.pdf
- Pads
- 10
- SMD
- 1.8×3.0
- Boards
- 84
LGA-16_3x3mm_P0.5mm_LayoutBorder3x5y
Package_LGA
LGA, 16 Pin (https://www.st.com/resource/en/datasheet/lis331dlh.pdf)
- Pads
- 16
- SMD
- 3.5×3.5
- Boards
- 61
Bosch_LGA-14_3x2.5mm_P0.5mm
Package_LGA
LGA-14 Bosch https://ae-bst.resource.bosch.com/media/_tech/media/datasheets/BST-BMI160-DS000-07.pdf
- Pads
- 14
- SMD
- 3.7×3.2
- Boards
- 60
TQFP-64_10x10mm_P0.5mm
Package_QFP
TQFP, 64 Pin (JEITA/EIAJ ED-7311A (variation 64-001-TCA) / JEDEC MS-026 (variation ACD), 1.00mm body thickness, https://www.jeita.or.jp/japanese/standard/book/ED-7311A/#target/page_no=30, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026)
- Pads
- 64
- SMD
- 13.3×13.3
- Boards
- 58
LGA-28_5.2x3.8mm_P0.5mm
Package_LGA
LGA 28 5.2x3.8mm Pitch 0.5mm
- Pads
- 28
- SMD
- 6.0×4.5
- Boards
- 56
TQFP-144_20x20mm_P0.5mm
Package_QFP
TQFP, 144 Pin (JEDEC MS-026 variation AFB, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026)
- Pads
- 144
- SMD
- 23.3×23.3
- Boards
- 52
DFN-8-1EP_3x2mm_P0.5mm_EP1.3x1.5mm
Package_DFN_QFN
DFN, 8 Pin (https://ww1.microchip.com/downloads/en/DeviceDoc/AT24C64D-I%C2%B2C-Compatible-(2-Wire)-Serial-EEPROM-64-Kbit-(8,192x8)-20005937C.pdf)
- Pads
- 9
- SMD
- 4.3×2.5
- Boards
- 47
WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm_ThermalVias
Package_SON
8-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf
- Pads
- 9
- SMD
- 3.2×2.5
- Boards
- 47
