Footprints
120 footprints matching “35”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
SOT-353_SC-70-5
Package_TO_SOT_SMD
SOT, 5 Pin (https://home.jeita.or.jp/tsc/std-pdf/ED-7500A.pdf#page=171, JEDEC MO-203, variant AA, https://www.jedec.org/document_search?search_api_views_fulltext=MO-203)
- Pads
- 5
- SMD
- 2.9×2.2
- Boards
- 407
R_2512_6332Metric_Pad1.40x3.35mm_HandSolder
Resistor_SMD
Resistor SMD 2512 (6332 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf)
- Pads
- 2
- SMD
- 8.0×3.9
- Boards
- 189
QFN-28-1EP_5x5mm_P0.5mm_EP3.35x3.35mm
Package_DFN_QFN
QFN, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=283)
- Pads
- 29
- SMD
- 6.2×6.2
- Boards
- 175
CP_EIA-3528-21_Kemet-B
Capacitor_Tantalum_SMD
Tantalum Capacitor SMD Kemet-B (3528-21 Metric), IPC-7352 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf)
- Pads
- 2
- SMD
- 4.9×3.3
- Boards
- 149
SSOP-16_3.9x4.9mm_P0.635mm
Package_SO
SSOP, 16 Pin (https://www.nxp.com/docs/en/package-information/SOT519-1.pdf#page=2)
- Pads
- 16
- SMD
- 7.4×5.4
- Boards
- 98
CP_EIA-3528-15_AVX-H
Capacitor_Tantalum_SMD
Tantalum Capacitor SMD AVX-H (3528-15 Metric), IPC-7352 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf)
- Pads
- 2
- SMD
- 4.9×3.3
- Boards
- 61
CP_EIA-3528-12_Kemet-T
Capacitor_Tantalum_SMD
Tantalum Capacitor SMD Kemet-T (3528-12 Metric), IPC-7352 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf)
- Pads
- 2
- SMD
- 4.9×3.3
- Boards
- 58
SSOP-20_3.9x8.7mm_P0.635mm
Package_SO
SSOP20: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf)
- Pads
- 20
- SMD
- 6.9×9.3
- Boards
- 54
QSOP-16_3.9x4.9mm_P0.635mm
Package_SO
QSOP, 16 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0055.PDF)
- Pads
- 16
- SMD
- 7.4×5.4
- Boards
- 45
SSOP-28_3.9x9.9mm_P0.635mm
Package_SO
SSOP28: plastic shrink small outline package; 28 leads; body width 3.9 mm; lead pitch 0.635; (see http://cds.linear.com/docs/en/datasheet/38901fb.pdf)
- Pads
- 28
- SMD
- 6.9×10.4
- Boards
- 33
USB_C_Receptacle_GCT_USB4135-GF-A_6P_TopMnt_Horizontal
Connector_USB
USB Type C Receptacle, GCT, power-only, 6P, top mounted, horizontal, 3A: https://gct.co/files/drawings/usb4135.pdf
- Pads
- 7
- SMD
- 13.1×8.2
- Boards
- 31
SSOP-24_3.9x8.7mm_P0.635mm
Package_SO
SSOP24: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot556-1_po.pdf)
- Pads
- 24
- SMD
- 6.9×9.3
- Boards
- 30
DIP-6_W8.89mm_SMDSocket_LongPads
Package_DIP
6-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads
- Pads
- 6
- SMD
- 12.5×8.2
- Boards
- 21
LED_RGB_Wuerth-PLCC4_3.2x2.8mm_150141M173100
LED_SMD
3.2mm x 2.8mm PLCC4 LED, https://www.we-online.de/katalog/datasheet/150141M173100.pdf
- Pads
- 4
- SMD
- 5.1×3.3
- Boards
- 16
HTSSOP-56-1EP_6.1x14mm_P0.5mm_EP3.61x6.35mm
Package_SO
HTSSOP56: plastic thin shrink small outline package http://www.ti.com/lit/ds/symlink/drv8301.pdf
- Pads
- 57
- SMD
- 9.6×14.6
- Boards
- 16
DIP-4_W8.89mm_SMDSocket_LongPads
Package_DIP
4-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads
- Pads
- 4
- SMD
- 12.5×5.7
- Boards
- 15
DFN-14-1EP_3x3mm_P0.4mm_EP1.78x2.35mm
Package_DFN_QFN
DD Package; 14-Lead Plastic DFN (3mm x 3mm) (http://pdfserv.maximintegrated.com/land_patterns/90-0063.PDF)
- Pads
- 15
- SMD
- 4.0×3.6
- Boards
- 14
QFN-28-1EP_5x5mm_P0.5mm_EP3.35x3.35mm_ThermalVias
Package_DFN_QFN
QFN, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=283)
- Pads
- 29
- SMD
- 6.2×6.2
- Boards
- 14
SW_DIP_SPSTx01_Slide_Omron_A6S-110x_W8.9mm_P2.54mm
Button_Switch_SMD
SMD 1x-dip-switch SPST Omron_A6S-110x, Slide, row spacing 8.9 mm (350 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf)
- Pads
- 2
- SMD
- 10.9×4.1
- Boards
- 12
QSOP-24_3.9x8.7mm_P0.635mm
Package_SO
QSOP, 24 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0055.PDF)
- Pads
- 24
- SMD
- 7.4×9.2
- Boards
- 10
BGA-121_9.0x9.0mm_Layout11x11_P0.8mm_Ball0.4mm_Pad0.35mm_NSMD
Package_BGA
121-ball, 0.8mm BGA (based on http://www.latticesemi.com/view_document?document_id=213)
- Pads
- 121
- SMD
- 11.0×11.0
- Boards
- 9
CP_EIA-3528-21_Kemet-B_HandSolder
Capacitor_Tantalum_SMD
Tantalum Capacitor SMD Kemet-B (3528-21 Metric), IPC-7352 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf)
- Pads
- 2
- SMD
- 5.3×3.3
- Boards
- 8
QFN-20-1EP_5x5mm_P0.65mm_EP3.35x3.35mm
Package_DFN_QFN
QFN, 20 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=276)
- Pads
- 21
- SMD
- 6.2×6.2
- Boards
- 8
SSOP-48_7.5x15.9mm_P0.635mm
Package_SO
SSOP48: plastic shrink small outline package; 48 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot370-1_po.pdf)
- Pads
- 48
- SMD
- 11.1×16.5
- Boards
- 8